Introduce the process and reliability design of PCB fabrication
2019-06-21
The multilayer board process is developed on the basis of the double-sided metallization process. According to experts from the China Epoxy Resin Industry Association, this process has several unique contents in addition to the double-sided process: inner-layer interconnection of metallized holes, drilling and decontamination, positioning systems, layering, and special materials. Our commonly used computer cards are basically double-sided printed circuit boards based on epoxy glass cloth, one of which is plug-in components, and the other side is the soldering surface of the component feet. We can see that the solder joints are very regular. We call the discrete welding surface a solder joint.
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