PCB Technical - Related PCB Technology Blog Posts page 212

2021-07-20

It will be the general trend to PCB meeting halogen-free requirements

2021-07-19

This paper first makes a brief introduction to the high-frequency circuit board, then describes the PCB design of high-frequency circuit board wiring skills, and finally introduces the PCB design of high-frequency circuit board wiring precautions, specific follow the author to understand.

2021-07-16

What we say to do is to turn the designed schematic diagram into a real PCB. Please don't underestimate this process. There are many things that can work in principle but can't be realized in engineering, or others can't, so it's not difficult to make a good PCB, but it's not easy to make a good PCB.

2021-07-15

What are the PCB high frequency board materials? How to choose!

2021-07-14

With the development trend of miniaturization, portability, multi-function, low power consumption and low cost of electronic products, 2D (two-dimensional) packaging technology has been unable to meet the requirements, and some products have begun to develop in the direction of 2.5D or 3D packaging. In 2.5D or 3D packaging structure.

2021-07-13

The surface process of IC Substrate's PCB gold plating must meet the requirements of both gold wire bonding and solder bonding.

2021-07-13

Rigid Flex PCB Manufacturer and Correlation Technique

2021-07-12

Frequency modulation (FM) is the most common analog modulation skill in mobile communication system------Application of Teflon PCB in Frequency modulation

2021-07-05

Teflon PCB material.There are currently many types of high-speed and high-frequency PCB substrate materials. Teflon PCB is generally used in airplanes, rockets and high-performance electronic instruments.

2020-11-09

PCBA PCB assembly's basic technological process

2020-11-06

Process requirements in PCB production are a very important factor, which directly determines the quality and positioning of a PCB.

2020-10-30

When some PCB prototype manufacturers promote their products, they will specifically mention that their products use special processes such as gold plating and silver plating. So what is the use of this process?

2020-10-30

Because copper is easy to oxidize in the air, the oxide layer of copper has a great impact on the welding. It is easy to form false soldering and false soldering, which may cause the solder pad and components unable to be welded.

2020-10-20

Generally, the reflow furnace will use a chain to drive the PCB forward in the reflow furnace, that is, the two sides of the PCB are used as fulcrums to support the entire PCB. If there are heavy parts on the PCB or the size of the PCB is too large, Due to the amount of seed, it will show a depression in the middle, causing the plate to bend.

2020-10-20

On the SMT line, if the PCB board is not flat, it will cause inaccurate positioning, components cannot be inserted or mounted on the holes and surface mount pads of the PCB board, and the automatic insertion machine may even be damaged.

2020-10-15

we should pay close attention to the quality control plan of PCB Factory and the standard of maintenance. For example, for black nickel, it is necessary to see if the PCB production plant has chemical gold out of the factory, whether the concentration of the chemical solution is stable, whether the analysis frequency is enough, whether the regular gold stripping test and phosphorus content test are set to detect, whether the internal solder test is well performed, etc.

2020-10-12

PCB are divided into single-layer boards, double-sided boards, and multi-layer boards. The conductive patterns of single-sided boards are relatively simple, and only one side of the substrate has conductive patterns, while double-sided boards have conductive patterns on both sides. Metal holes are generally used. Connect the conductive images on both sides. Multi-layer boards have multiple substrate layers and complex conductive patterns, so they are more suitable for sophisticated electronic equipment. Therefore, PCB Fabrication companies with guaranteed quality should consider which type of PCB they need to use when designing and manufacturing.

2020-10-10

5G communication is a huge and complex integrated technology. Its challenges to the PCB process mainly focus on: large size, high multilayer, high frequency, high speed and low loss, high density, rigid-flex combination, high and low frequency mixed pressure, etc. So many process technologies put forward new or higher requirements on PCB materials, design, processing, and quality control. PCB companies need to understand the changing needs and propose a full range of solutions.

2020-10-10

5G development cannot leave the construction of large-scale data center, is bound to increase the server, the server cannot be separated from the development of PCB, because of the traffic carried by the data center and great for transmission speed requirement is very high, so to the requirement of PCB layers and materials will be more and more high, this kind of circumstance, the needs of high-end communication board are up significantly.

2020-10-04

Multisim has a super board level analog / digital circuit board design work. It includes the graphic input of circuit schematic diagram and the input mode of circuit hardware description language, which has rich simulation and analysis ability.