PCB Technical - Detailed explanation of PCBA MCM test after packaging

Generally speaking, the test cost of PCBA MCM accounts for about one-third of the total cost of PCBA MCM (chip cost and assembly cost also account for one-third each, but low-cost PCBA MCM may be an exception). The high cost of testing reminds designers that they must carefully consider testing issues when making design decisions. The test for a newly designed PCBA MCM is more complicated than a mature PCBA MCM test.

PCBA MCM poses new and unique problems to test engineers. These problems are the biggest challenges encountered in PCBA MCM testing. The complexity of PCBA MCM testing is greater than that of single-chip integrated circuits. PCBA MCM testing cannot use the same testing methods and equipment as previous integrated circuits. The testing process that PCBA MCM needs to carry out. Bare chips need to be tested with a probe station, so it is now possible to provide good quality single chips (KGD) or high-reliability chips (such as package yield rate of 99.9 or more) to packaging factories to improve the yield after packaging, aging and environmental testing This is especially important for mass production of PCBA MCM.

The PCBA MCM test after packaging generally includes the test of each individual chip, and the test checks whether it is damaged during the packaging process including the internal chip interconnection. Therefore, the test after PCBA MCM packaging is very complicated, especially for certain packaging forms such as grid array packaging.

The functional test of PCBA MCM may include very different test types from digital vector to environmental test, from high frequency to high power. If a PCBA MCM is newly designed to replace the existing single-chip package components, the functional tests to be carried out are the same .

MGM Outlook

According to the high-density packaging/PCBA MCM (HDP/PCBA MCM) Newsletter Issue 4, 2004 published by the International HDP Organization headquartered in the United States, ARIZONA predicts that the United States and Asia will use it because of the huge demand for consumer electronics and computer industries The main area for high-density packaging and PCBA MCM. We certainly have reason to believe that with the advancement of packaging technology and the promotion of market demand, PCBA MCM technology and applications will certainly receive more attention in China's integrated circuit industry, and China's integrated circuit packaging companies will gradually catch up with the world's high density. The trend of packaging technology.

With the continuous improvement of PCBA MCM technology and the strengthening of market driving force, the application of PCBA MCM will have a better prospect. Although PCBA MCM packaging has commercial challenges arising from the packaging of chips supplied by multiple suppliers, especially the testing and aging problems of large-capacity memory and ultra-large-scale chips, the diversified needs of electronic products and the continuous advancement of packaging and testing technology Driven by the development, PCBA MCM packaging will overcome challenges on the basis of today and win greater development.