PCBA Tech - smt's solutions to on-site problems and process optimization

smt patch solution to on-site problems

smt patch draws lessons from other production management methods, the current Japanese production management method is recognized by the world, especially the continuous improvement of the scene is considered the mystery of the success of Japanese companies. The "three-present principle" of "site, present, and reality" reflects the emphasis on the site and the idea of continuous improvement. The "site" is the place where products are manufactured and services are provided; the "real thing" is the main body of the site, which may be a malfunctioning machine, a substandard product, a damaged tool, or a customer who is complaining ; "Reality" is to analyze the real thing on the spot and solve the problems that occur. This is a very effective management concept for production enterprises.

For the "three-present principle", it is emphasized that the management personnel go to the site to analyze and solve the problems of the existing objects. When a problem occurs, the place to solve the problem should be the site, not the office or conference room.

On the spot, the management personnel can usually find the problem and take countermeasures in time by inspecting the real thing, observing, touching, feeling, and combining their own experience. The "three-present principle" is brought into play and developed into a "five-present technique": on-site, physical, reality, cash, and current recognition. The addition of "cash" and "recognition" on the basis of the "three-present principle" means that the results of on-site improvement are converted into an amount to be confirmed, emphasizing the quantification and cost awareness of the improvement results. The essence of the "three-present principle" is to attach importance to the scene. As factory managers, the experience we have gained is: to solve on-site problems, we must go to the site.

On-site problem solving law:

1. Go to the scene first when a problem occurs;

2. Check the real thing;

3. Take temporary countermeasures on the spot;

4. Analyze the reasons and find out the countermeasures;

5. The smt patch adopts standardized processing technology to prevent accidents from happening again.

Process optimization in smt patch

As people's requirements for electronic devices are getting higher and higher, smt patches are facing upgrade challenges in terms of functions and hardware. The volume is getting smaller and smaller, and the precision of PCBA processing and assembly is getting higher and higher. The required volume of all electronic components can no longer be described as small, and it is immediately a small electronic device. In addition, in the wave soldering process, the processing technology, soldering material raw materials, PCB processing circuit board quality, machine equipment and other factors are harmful to the quality of electric welding. Therefore, there are many invisible shortcomings in the whole process of wave soldering, and the appearance inspection is generally not easy. find out. Usually after it is delivered to the customer, during the entire application process, spot welding is invalidated early due to factors such as power-on, vibration, and working temperature change.

Many years of smt processing experience put forward some suggestions on wave soldering process:

1. Many shortcomings of wave soldering clocks are related to PCB design, so DFM must be considered.

2. Many shortcomings are related to the quality of PCB and SMT chip processing electronic devices, in order to prevent counterfeit and inferior products from harming the quality of electronic devices. The dealers who meet the standards should be selected, with controllable freight logistics and storage standards.

3. Many shortcomings come from insufficient specificity of the flux. A good flux can withstand high temperatures, avoid bridging, and improve the tin penetration rate of buried holes.

4. Set the wave soldering temperature as low as possible to avoid over-temperature of components, destruction of raw materials, especially the secondary melting of tin in the mixed-play processing technology.

5. The low welding material temperature can alleviate the air oxidation of the solder wire, reduce tin dross, and alleviate the deposition of the molten welding material on the welding material tank and the centrifugal impeller. Limit the conversion of FeSn2 crystals.

6. Excellent SMT processing technology control can reduce the level of defects. Comprehensive adjustment of the main parameters of the processing technology should be carried out, and the temperature curve must be manipulated.

7. Pay attention to the maintenance of soldering materials in the tin furnace in smt patch, and improve the usual maintenance of machinery and equipment.