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Striving for high reliability and high efficiency in SMT processing (surface mount technology) assembly has always been the goal of electronic manufacturers expecting consistency. It depends on the optimization of every detail of the whole process. As far as SMT assembly is concerned, it is concluded that 64% of defects are due to incorrect solder paste printing. Moreover, defects lead to low product reliability and reduce its performance. Therefore, it is necessary to perform high-performance solder paste printing to minimize the possibility of low quality.
Inspection is a necessary measure for SMT assembly requirements. At present, the commonly used inspections include visual inspection, AOI (Automated Optical Inspection), X-ray inspection and so on. In order to prevent improper solder paste printing from degrading the performance of the final product, solder paste inspection (SPI) solder paste printing during the SMT assembly process should be performed after soldering.
Based on 20 years of experience in electronics manufacturing, Jingbang's deep concern for product reliability has won a good reputation in the world's electronics industry. Jingbang Electronics' one-stop PCBA processing includes PCB manufacturing, component procurement and smt patch assembly. The smooth operation comes from the strict process control in the workshop.
SPI usually appears after the solder paste is printed, so that printing defects can be found in time so that they can be corrected or eliminated before placement. Or, it may cause more defects or even disasters in the later stage.
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Advantages of SPI
1. Reduce defects
SPI is first used to reduce defects caused by improper solder paste printing. Therefore, the primary advantage of SPI lies in its ability to reduce defects. As far as SMT assembly is concerned, defects have always been a major problem. The reduction in their number will lay a solid foundation for the high reliability of the product.
2. High efficiency
Think of the traditional SMT assembly process rework model. Unless inspection is performed, that is, usually after reflow soldering, no defects will be exposed. Usually, AOI or X-ray inspection is used to find defects and then rework. If SPI is used, defects can be found at the beginning of the SMT assembly process after the solder paste is printed. Once the incorrect solder paste printing is found, it can be reworked immediately to obtain high-quality solder paste printing. Will save more time and improve manufacturing efficiency.
3. Low cost
For the application of SPI machine, low cost has two meanings. On the one hand, since defects can be found in the early stages of the SMT assembly process, and rework can be completed in time, time costs will be reduced. On the other hand, since defects can be stopped earlier to avoid delaying early defects to the later manufacturing stage, leading to threatening defects, capital will also be reduced.
Fourth, high reliability
As discussed at the beginning, most of the defects in SMT chip assembly products stem from low-quality solder paste printing. Since SPI is conducive to reducing defects, it will help improve product reliability by strictly controlling the source of defects.
