PCBA Tech - Analysis of bad problem solving during PCBA processing

Analysis of bad problem solving during PCBA processing

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It seems to be welded on the surface, but there is no actual internal connection, or it is in an intermediate unstable state where it may or may not be connected. This is the most hateful. It is more difficult to find the problem.
It is often referred to as cold solder, some of which are caused by poor soldering or lack of tin, which causes the component feet and solder pads to fail to conduct, and others are caused by oxidation or impurities in component feet and solder pads. It is indeed not easy to see with the naked eye.

PCBA virtual soldering in PCBA processing is a common line fault, there are two types,
One is in the production process, caused by improper production technology, the unstable state of the flow and the flow of time;
The other is that after long-term use of electrical appliances, some parts with severe heat generation are very likely to be caused by aging and peeling at the solder joints at the solder feet.

How to judge, users can search on the Internet, there are many ways.

The English name cold solder is generally caused by oxidation or impurities in the solder joints and poor soldering temperature, caused by improper methods. The essence is that there is an isolation layer between the solder and the pins. They are not completely in contact with each other. It is generally invisible to the naked eye. Its state. But its electrical characteristics are not continuity or poor continuity. It affects the circuit characteristics.

The components must be stored in moisture-proof. For in-line electrical appliances, it can be slightly polished. When soldering, solder paste and flux can be used. It is best to use a reflow soldering machine. Manual soldering must be a good technique. As long as the first soldering is good. Normal "After long-term use of electrical appliances, some parts with severe heat generation, the solder joints at the solder feet are very likely to be caused by aging and peeling." This is because the board base is not good.

When there is a problem in PCBA processing, the first thing that must be checked is the basic conditions of the manufacturing process:
1 Material issues:
These include solder chemical materials such as flux, oil, tin, cleaning materials, and PCB coating materials. Such as anti-oxidation resin,
Temporary or permanent solder mask inks and printing inks, etc.
2 Poor solderability:
This involves all soldering surfaces, such as parts (including surface-adhesive parts/SMT parts), PBC and electroplated through-holes.
Must be considered.
3 Deviation of production equipment:
Including deviations of machinery and equipment and maintenance, as well as external factors, temperature, speed and angle of the conveyor belt, as well as the depth of immersion, etc.
Etc. is a variable directly related to the machine. In addition, external factors such as ventilation, reduction of air pressure, and voltage reduction, etc.
All must be included in the scope of analysis.
It seems to be welded on the surface, but there is no actual internal connection, or it is in an intermediate unstable state where it may or may not be connected. This is the most hateful. It is more difficult to find the problem.
It is often referred to as cold solder, some of which are caused by poor soldering or lack of tin, which causes the component feet and solder pads to fail to conduct, and others are caused by oxidation or impurities in component feet and solder pads. It is indeed not easy to see with the naked eye.

PCBA virtual soldering in PCBA processing is a common line fault, there are two types,
One is in the production process, caused by improper production technology, the unstable state of the flow and the flow of time;
The other is that after long-term use of electrical appliances, some parts with severe heat generation are very likely to be caused by aging and peeling at the solder joints at the solder feet.

How to judge, users can search on the Internet, there are many ways.
The English name cold solder is generally caused by oxidation or impurities in the solder joints and poor soldering temperature, caused by improper methods. The essence is that there is an isolation layer between the solder and the pins. They are not completely in contact with each other. It is generally invisible to the naked eye. Its state. But its electrical characteristics are not continuity or poor continuity. It affects the circuit characteristics.

The components must be stored in moisture-proof. For in-line electrical appliances, it can be slightly polished. When soldering, solder paste and flux can be used. It is best to use a reflow soldering machine. Manual soldering must be a good technique. As long as the first soldering is good. Normal "After long-term use of electrical appliances, some parts with severe heat generation, the solder joints at the solder feet are very likely to be caused by aging and peeling." This is because the board base is not good.

When there is a problem in PCBA processing, the first thing that must be checked is the basic conditions of the manufacturing process:
1 Material issues:
These include solder chemical materials such as flux, oil, tin, cleaning materials, and PCB coating materials. Such as anti-oxidation resin,
Temporary or permanent solder mask inks and printing inks, etc.
2 Poor solderability:
This involves all soldering surfaces, such as parts (including surface-adhesive parts/SMT parts), PBC and electroplated through-holes.
Must be considered.
3 Deviation of production equipment:
Including deviations of machinery and equipment and maintenance, as well as external factors, temperature, speed and angle of the conveyor belt, as well as the depth of immersion, etc.
Etc. is a variable directly related to the machine. In addition, external factors such as ventilation, reduction of air pressure, and voltage reduction, etc.
All must be included in the scope of analysis.
It seems to be welded on the surface, but there is no actual internal connection, or it is in an intermediate unstable state where it may or may not be connected. This is the most hateful. It is more difficult to find the problem.
It is often referred to as cold solder, some of which are caused by poor soldering or lack of tin, which causes the component feet and solder pads to fail to conduct, and others are caused by oxidation or impurities in component feet and solder pads. It is indeed not easy to see with the naked eye.

PCBA virtual soldering in PCBA processing is a common line fault, there are two types,
One is in the production process, caused by improper production technology, the unstable state of the flow and the flow of time;
The other is that after long-term use of electrical appliances, some parts with severe heat generation are very likely to be caused by aging and peeling at the solder joints at the solder feet.

How to judge, users can search on the Internet, there are many ways.
The English name cold solder is generally caused by oxidation or impurities in the solder joints and poor soldering temperature, caused by improper methods. The essence is that there is an isolation layer between the solder and the pins. They are not completely in contact with each other. It is generally invisible to the naked eye. Its state. But its electrical characteristics are not continuity or poor continuity. It affects the circuit characteristics.

The components must be stored in moisture-proof. For in-line electrical appliances, it can be slightly polished. When soldering, solder paste and flux can be used. It is best to use a reflow soldering machine. Manual soldering must be a good technique. As long as the first soldering is good. Normal "After long-term use of electrical appliances, some parts with severe heat generation, the solder joints at the solder feet are very likely to be caused by aging and peeling." This is because the board base is not good.

When there is a problem in PCBA processing, the first thing that must be checked is the basic conditions of the manufacturing process:
1 Material issues:
These include solder chemical materials such as flux, oil, tin, cleaning materials, and PCB coating materials. Such as anti-oxidation resin,
Temporary or permanent solder mask inks and printing inks, etc.
2 Poor solderability:
This involves all soldering surfaces, such as parts (including surface-adhesive parts/SMT parts), PBC and electroplated through-holes.
Must be considered.
3 Deviation of production equipment:
Including deviations of machinery and equipment and maintenance, as well as external factors, temperature, speed and angle of the conveyor belt, as well as the depth of immersion, etc.
Etc. is a variable directly related to the machine. In addition, external factors such as ventilation, reduction of air pressure, and voltage reduction, etc.
All must be included in the scope of analysis.