A few days ago, PCB company integrated its PCB design solutions and released a new version of Xpedition VX, which re-architected and innovated in various aspects such as ease of use, automation and data management, aiming to solve the increasing complexity of PCB design. Effectiveness, cost and quality, production and design, etc. The new platform includes NPI solutions that can seamlessly connect PCB design and manufacturing, and Xpedition Path Finder kits for efficient IC/package/PCB design optimization.
The New Product Introduction (NPI) solution is the industry’s first integrated and automated PCB design, manufacturing and assembly process, which can help design-level and product-level NPI engineers prepare and verify according to the manufacturer’s rule set in the engineer’s original design tool Product model can ensure excellent production design without special manufacturing knowledge or experience.
Process-level NPI engineers can evaluate and create process toolkits without manually inputting data. Manufacturers will get a "correct first time" design to avoid production errors. This move eliminates the distance between designers and manufacturers. Manufacturers can create and adjust rules according to manufacturing requirements, while designers only need to comply with these manufacturing requirements, so as to achieve a truly two-way, consistent and same set of rules-based process. It can greatly reduce design revisions, improve overall product quality, and shorten product delivery cycles.
The NPI process solution first defines the final PCB product model and verifies it, and then provides the product model through three stages: definition of the manufacturing process, workshop fixture preparation, and work instruction preparation. Therefore, it is a true PCB design and manufacturing that goes through from end to end. solution. The lean NPI process uses the ODB++ v8 open standard for intelligent data transmission from design to manufacturing.
Another newly developed Xpedition Path Finder product suite can solve today's system design complexity problems. The kit supports the use of layout data from IC and circuit board design teams to guide and automate IC package selection and optimization. It provides designers with the function of assembling and optimizing complex electronic systems, thereby improving design, enhancing chip performance and increasing costs efficient.
The Xpedition Path Finder suite provides an industry-leading new path finding method in response to the increasing complexity of system-on-chip (SoC) and the growth of multi-chip packaging. It can automatically plan and optimize chip connectivity through multiple packaging variables. At the same time, it also targets multiple different PCB platforms. Using a multi-mode connectivity environment, designers can capture and manage connectivity based on priority. Path Finder can also simplify and automate the library development process, so that days-consuming work can be completed in just a few minutes.
It is reported that this new version of Xpedition VX will pay more attention to the construction of the process, rather than simply emphasizing the use of a single tool. The new platform incorporates the advantages of many tools on the original Xpedition platform, and will focus on optimizing wiring efficiency, multi-version system design, efficient FPGA/PCB co-design, system-level thermal verification, and electrical acceptance to optimize system performance.