PCB技術 - 高信頼性PCBの特徴

1. Use internationally well-known substrates-do not use "local" or unknown brands

Benefit:

Improve 信頼性 and known performance

Risk of not doing so:

Poor mechanical performance means that the circuit board cannot perform the expected performance under assembly conditions. 例えば, 高い膨張性能は層間剥離を引き起こす, 切断と反り. 弱くなった電気特性は、インピーダンス性能が悪い.

2. 25 micron hole wall copper thickness

Benefit:

Enhance reliability, z軸の膨張抵抗を改善することを含む.

Risk of not doing so:

Blow holes or degassing, electrical connectivity problems during assembly (inner layer separation, hole wall fracture), または実際の使用時の負荷条件下での故障. IPCClass2 (the standard adopted by most factories) requires 20% less copper plating.

3. No welding repair or open circuit repair

Benefit:

Perfect circuit can ensure reliability and safety, メンテナンス, no risk

Risk of not doing so:

If repaired improperly, 回路基板が壊れます. 仮に修理があったとしても、適切な旋風, there is a risk of failure under load conditions (vibration, etc.), 実際の使用に失敗する可能性があります.

4. Requirements for the depth of the plug hole

Benefit:

High-quality plug holes will reduce the risk of failure during assembly.

Risk of not doing so:

The chemical residues in the gold-immersion process may remain in the hole that is not full of the plug hole, はんだ付け性などの問題を引き起こす. Moreover, 穴に隠されたビーズがあるかもしれない, アセンブリまたは実際の使用中に飛び出す可能性があります, 短絡を引き起こす.

5. Cleanliness requirements exceeding IPC specifications

Benefit:

Improving PCB cleanliness can increase reliability.

Risk of not doing so:

Residues and solder accumulation on the circuit board bring risks to the solder mask. イオン性残留物は、はんだ付け表面で腐食及び汚染リスクを引き起こす可能性がある, which may lead to reliability problems (bad solder joints/electrical failures) and ultimately increase the occurrence of actual failures Probability.

6. Lianshuo Circuit performs specific approval and ordering procedures for each purchase order

Benefit:

The execution of this program ensures that all specifications have been confirmed.

Risk of not doing so:

If the product specifications are not carefully confirmed, 結果として生じる偏差は、アセンブリまたは最終製品まで発見されない, そして、今回は遅すぎます.

7. Strictly control the service life of each surface treatment

Benefit:

Solderability, reliability, and reduce the risk of moisture intrusion

Risk of not doing so:

Due to the metallographic changes in the surface treatment of the old circuit boards, はんだ付け問題が起こる, そして、湿気侵入は剥離のような問題を引き起こすかもしれません, separation (open circuit) of the inner layer and the hole wall during the assembly process and/または実際の使用 .

8. 銅被覆ラミネートの許容度はIPC 4101 ClassBの要求に適合する/L

Benefit:

Strictly controlling the thickness of the dielectric layer can reduce the deviation of expected electrical performance.

Risk of not doing so:

The electrical performance may not meet the specified requirements, と出力/コンポーネントの同じバッチのパフォーマンスは全く異なります.

9. Define solder mask materials to ensure compliance with IPC-SM-840ClassT requirements

Benefit:

ipcb Circuits recognizes "excellent" inks, インクの安全性を実現, そして、はんだマスクインクがUL規格を満たすのを確実にします.

Risk of not doing so:

Inferior inks can cause adhesion, フラックス抵抗と硬さ問題. すべてのこれらの問題は、ハンダ・マスクを回路基板から分離させる, そして、結局銅回路の腐食につながります. 絶縁性が悪いため、予期しない電気的連続性に起因する短絡を引き起こすことがある/アーク.

10. 形状の許容範囲の定義, holes and other mechanical features

Benefit:

Strict tolerance control can improve the dimensional quality of products-improve fit, shape and function

Risk of not doing so:

Problems in the assembly process, 整列のような/fitting (the problem of press-fitting needles will only be discovered when the assembly is completed). 加えて, サイズ偏差の増加により, ベースのインストールに問題があるでしょう.

11. Lishushuo回路は、はんだマスクの厚さを指定する, although IPC does not have relevant regulations

Benefit:

Improve the electrical insulation properties, 剥離や粘着の損失を減らす, 機械的衝撃が発生しても機械的衝撃に抵抗する能力を強化する!

Risk of not doing so:

Thin solder mask can cause adhesion, フラックス抵抗と硬さ問題. すべてのこれらの問題は、ハンダ・マスクを回路基板から分離させる, そして、結局銅回路の腐食につながります. 薄いはんだマスクに起因する絶縁性の悪い特性は、偶発的な導通に起因する短絡を引き起こす可能性がある/アーク.

12. 外観要件と修理要件を定義, although IPC does not define

Benefit

Careful care and carefulness in the manufacturing process create safety.

Risk of not doing so:

Various scratches, 軽傷, 修理と修理は、回路基板がうまく動作しません. 表面で見ることができる問題に加えて, 目に見えないリスクとは, 組立への影響, そして実際の使用におけるリスク?

13. Sockets with scrap units are not accepted

Benefit:

Not using partial assembly can help customers improve efficiency.

Risk of not doing so:

A defective board requires a special assembly procedure. If it is not clear to mark the scrap unit board (x-out) or not isolate it from the board, この既知の悪いボードを組み立てることが可能です, 無駄な部分と時間.

14. PetersSD2955 specifies the brand and model of peelable blue glue

Benefit:

The designation of peelable blue glue can avoid the use of "local" or cheap brands.

Risk of not doing so:

Inferior or cheap peelable glue may foam, 融液, 組立工程中にコンクリートのように亀裂または固化する, 剥離可能な接着剤を剥離することができない/働かないさま.