Noticias de PCB - Proceso de soldadura de resistencia de PCB

Proceso de soldadura de resistencia de PCB

La máscara de soldadura es una capa de tinta impresa en la superficie de PCB. No sólo funciona en aislamiento, Y también juega un papel en la protección de la superficie de cobre. También juega un papel hermoso. Es como un vestido, usado fuera de una placa de circuito impreso.. Es fácil detectar cualquier defecto, Por lo tanto, en todos los procesos, la película de soldadura es la más susceptible a las quejas de los clientes. En Proceso de soldadura de resistencia de PCB, Si usted es inteligente y experimentado, también puede tener problemas de calidad. Los siguientes fabricantes de circuitos de Shenzhen resumen algunos problemas comunes para usted, Espero inspirarte y ayudarte.. The common ones are as follows:

Problem: penetration, blur
Reason 1: The ink viscosity is too low.
Medidas de mejora: aumentar la concentración sin diluyente.
Causa 2: alta presión de impresión serigráfica.
Medidas de mejora: reducción de la presión.
Razón 3: raspador roto.
Medidas de mejora: cambiar o cambiar el ángulo de la pantalla del raspador.
Razón 4: la distancia entre la pantalla y la superficie de impresión es demasiado grande o demasiado pequeña.
Medidas de mejora: ajuste del espaciamiento.
Razón 5: la tensión de la pantalla se hace más pequeña.
Mejoras: reproducción de una nueva versión de la pantalla.

Problem: sticky film
Reason 1: The ink is not baked dry
Improvement measures: check the ink dryness
Reason 2: The vacuum is too strong
Improvement measures: check the vacuum system (can not add air guide)

Problem: Poor exposure
Reason 1: Poor vacuum
Improvement measures: check the vacuum system
Reason 2: Improper exposure energy
Improvement measures: adjust the appropriate exposure energy
Reason 3: The temperature of the exposure machine is too high
Improvement measures: check the temperature of the exposure machine (below 26°C)

Problem: White spots in printing
Reason 1: White spots in printing
Improvement measures: mismatched diluents, use matching diluents [please use the company's supporting diluents]
Reason 2: The sealing tape is dissolved
Improvement measures: switch to white paper to seal the net

Problem: Excessive development (corrosion test)
Reason 1: The concentration of the potion is too high and the temperature is too high
Improvement measures: reduce the concentration and temperature of the potion
Reason 2: Development time is too long
Improvement measures: shorten the development time
Reason 3: insufficient exposure energy
Improvement measures: increase exposure energy
Reason 4: The developing water pressure is too large
Improvement measures: lower the developing water pressure
Reason 5: Ink mixing is uneven
Improvement measures: stir the ink evenly before printing
Reason 6: The ink is not dried
Improvement measures: Adjust the baking parameters, see the question [The ink does not dry]

Problem: the ink won't dry
Reason 1: The oven exhaust is not good
Improvement measures: check the exhaust air condition of the oven
Reason 2: The oven temperature is not enough
Improvement measures: Determine whether the actual temperature of the oven reaches the required temperature of the product
Reason 3: Put less thinner
Improvement measures: increase diluent, fully dilute
Reason 4: The thinner dries too slowly
Improvement measures: use matching thinner [please use the company's supporting thinner]
Reason 5: The ink is too thick
Improvement measures: appropriately adjust the ink thickness

Problem: Green Oil Bridge Broken Bridge
Reason 1: Insufficient exposure energy
Improvement measures: increase exposure energy
Reason 2: The board is not handled properly
Improvement measures: check the treatment process
Reason 3: Too much pressure for developing and washing
Improvement measures: check the developing and washing pressure

Problem: post-bake oil
Reason 1: There is no segmented baking
Improvement measures: segmented baking
Reason 2: Insufficient viscosity of plug hole ink
Improvement measures: adjust the ink viscosity of the plug hole

Problem: Poor upper tin
Reason 1: The development is not clean
Improvement measures: improve several factors of poor development
Reason 2: Post-baking solvent contamination
Improvement measures: increase oven exhaust or machine cleaning before spraying tin

Problem: Foaming on the tin
Reason 1: Excessive development
Improvement measures: improve the development parameters, see the problem [over development]
Reason 2: The pre-treatment of the board is not good, and the surface is oily and dusty
Improvement measures: do a good job of pre-treatment of the board and keep the surface clean
Reason 3: insufficient exposure energy
Improvement measures: check the exposure energy and meet the ink usage requirements
Reason 4: Abnormal flux
Improvement measures: adjust flux
Reason 5: Insufficient post-baking
Improvement measures: baking process after inspection

Problem: Ink discoloration
Reason 1: Insufficient ink thickness
Improvement measures: increase ink thickness
Reason 2: Oxidation of the substrate
Improvement measures: check the pre-treatment process
Reason 3: The post-baking temperature is too high
Improvement measures: too long time after checking the baking parameters

Problem: The development is not clean
Reason 1: The storage time after printing is too long
Improvement measures: control the placement time within 24 hours
Reason 2: The ink runs out before development
Improvement measures: work in the darkroom before developing (the fluorescent lamp is wrapped in yellow paper)
Reason 3: Not enough developing potion
Improvement measures: the temperature is not enough, check the concentration and temperature of the medicine
Reason 4: Development time is too short
Improvement measures: extend the development time
Reason 5: Exposure energy is too high
Improvement measures: adjust the exposure energy
Reason 6: The ink is over-baked
Improvement measures: adjust the baking parameters, not to burn to death
Reason 7: Ink mixing is uneven
Improvement measures: stir the ink evenly before printing
Reason 8: The thinner does not match
Improvement measures: use matching thinner [please use the company's supporting thinner]

Problem: ink matt
Reason 1: The thinner does not match
Improvement measures: use matching thinner [please use the company's supporting thinner]
Reason 2: Low exposure energy
Improvement measures: increase exposure energy
Reason 3: Excessive development
Improvement measures: improve the development parameters, see the problem [over development]

Problem: Blocking the Internet
Reason 1: Drying is too fast.
Medidas de mejora: añadir Desecante lento.
Razón 2: la velocidad de impresión es demasiado lenta.
Medidas de mejora: aumentar la velocidad y ralentizar el Desecante.
Razón 3: alta viscosidad de la tinta.
Medidas de mejora: añadir lubricante de tinta o Desecante súper lento.
Razón 4: diluyente inadecuado.
Medidas de mejora: utilizar diluyentes específicos.

Problem: Ink adhesion is not strong
Reason 1: The ink model is not suitable.
Medidas de mejora: utilizar tinta adecuada.
Razón 2: el modelo de tinta no es adecuado.
Medidas de mejora: utilizar tinta adecuada.
Razón 3: el tiempo de secado y la temperatura no son correctos, la cantidad de gas de escape es demasiado pequeña durante el secado.
Medidas de mejora: utilizar la temperatura y el tiempo correctos, Y aumentar el volumen de escape.
Causa 4: uso inadecuado o incorrecto de aditivos.
Medidas de mejora: ajustar la dosis o cambiar a otros aditivos.
Causa 5: humedad demasiado alta.
Medidas de mejora: mejora de la sequedad del aire.

IPCB es una empresa de fabricación de alta tecnología especializada en el desarrollo y la producción de PCB de alta precisión.. IPCB está encantado de ser su socio de Negocios. Nuestro objetivo de negocio es ser el prototipo más profesional Fabricante de PCB En el mundo. Se centra principalmente en PCB de microondas de alta frecuencia, Presión de mezcla de alta frecuencia, Ensayo de circuitos integrados multicapas ultraaltos, from 1+ to 6+ HDI, HDI de capa arbitraria, Sustrato de circuito integrado, Tablero de pruebas IC, PCB rígido y flexible, Ordinario PCB fr4 multicapa, Etc.. Los productos se utilizan ampliamente en la industria.0, Comunicaciones, Control industrial, Digital, Poder, Computadora, Automóvil, Médico, Aeroespacial, Instrumentos, Internet de las cosas y otras esferas.