PCB Technical - Introduction to the cost of PCBA MCM in the market

When COB has been widely used in mass-produced electronic products, the use of PCBA MCM in PCs, cameras and other products is still in a hovering period. The total cost of using PCBA MCM on the PCB of ordinary products is higher than that of using single-chip ICs. . In the more than 20 years since PCBA MCM began to be used, although the advantages of PCBA MCM have been recognized, its high cost makes it only rarely used in the field of high-end products. The reason why PCBA MCM has not achieved widespread success is mainly because of KGD (Known Good Die), high substrate cost, high packaging cost, and low pass rate. Internationally, PCBA MCM is therefore called PCBA MCMS (Must Cost Millions)-must spend

It costs millions. In recent years, due to the huge driving force of the market and the development of new technologies, especially the development of packaging technology, a variety of PCBA MCM packaging technologies including low-cost FCBGA PCBA MCM have been mastered by some foreign companies,

especially PCBA MCM integrated circuits. Low-cost consumer PCBA MCM integrated circuits have entered the market in large quantities. Now, whether a standardized shape can be used to package PCBA MCM has become one of the keys to reducing costs.

The use of PCBA MCM can keep the speed of the system unchanged and increase the yield rate, reduce the use of high-leg count packages, reduce the size and number of layers of the circuit board, and reduce the manufacturing process. The current cost advantage of PCBA MCM will be further reduced in the future.

With the increase in chip integration density, the process cost of the chip has risen sharply, and it is more difficult to benefit from chip manufacturing. Sometimes it is impossible to change the mask frequently for the profit of chip manufacturing. For high-density needs, it is possible to select first-class chips to form PCBA MCM. Likewise, a certain type of chip can be used in many different chipsets.

Semiconductor chip suppliers can obtain additional profits in the development of chips and associated interconnection systems. Therefore, PCBA MCM has become a powerful strategic choice for successful semiconductor chip suppliers.

Because PCBA MCM has a wide range of applications, it is very important for PCBA MCM to choose packaging materials. Due to the different use environments, special attention should be paid to choosing different packaging materials.

For decades, peripheral lead pin packages such as PDIP, SOP, and QPP have been widely used in single-chip packages. The design of PCBA MCM now often adopts the same packaging form as the single-chip package, because this can reduce the update of PCB production tools and test equipment. The end user of electronic products does not know whether the package is multi-chip or single-chip. Such PCBA MCMs can use all different substrates (sheet substrates, ceramic substrates, films, etc.). If the frequency of use is required for this type of PCBA MCM, short leads or leadless packages are now increasingly used.

1. Simplified PCB board design

Subsystems with high interconnection density can be integrated into a PCBA MCM, and the external connections of the PCBA MCM are reduced, thereby reducing the number of layers of the PCB.

2. Improve wafer utilization

When the chip area is greater than 100 square millimeters, the utilization rate of the wafer will decrease. The reduction in utilization rate will greatly increase the cost of chip manufacturing. For the same function, such as PCBA MCM composed of small chips, the increase in wafer utilization rate will bring more savings than the entire cost of PCBA MCM.

3. Reduce investment risk

Because PCBA MCM uses mature/standard chips, time-to-market and time-to-volume (time-to-market and time-to-volume) can be accelerated, and investment risk is reduced.