PCB is known as the "mother of electronic components" and is a bridge that carries electronic components and connects circuits. However, in the past two years, the Sino-US trade conflict and the new crown epidemic have caused a huge impact on the semiconductor industry, and PCBs are also indispensable. The avoidance was affected to a certain extent.
According to industry sources, from the current terminal market and supply chain feedback, the current demand for PCBs is actually rising, including 5G, smart homes, and new energy vehicles. Taking new energy vehicles as an example, the demand for PCBs will be 4-5 times that of traditional vehicles, and the overall market demand is strong.
At the same time, due to the shortage of chips in the market, the progress of many customers' products is not as expected, including PCB assembly and later production of finished products have been affected to a certain extent.
The PCB industry has developed for such a long time, and now there have been some new changes in PCB design. One is more miniaturization, mainly driven by the demand for portability of smart devices; the other is the change of PCB from a traditional rigid board to a flexible and hard board. And as the PCB moves towards the high-end, there will be two main aspects, one is the higher and higher data carrying and transmission rate, and the other is for smart homes and wearable devices, where the demand for HDI becomes more and more obvious.
A good PCB needs to meet the signal integrity, power integrity and electromagnetic compatibility design, which is mainly reflected in the circuit performance. At the level that the user can see with the naked eye, an excellent PCB work should be densely spaced, neat and symmetrical, and take into account the aesthetics of the layout. At the same time, it takes into account the user's operating habits, such as the reasonable layout of the sockets on the panel, which is convenient for plugging and unplugging, and there are clear safety instructions.
According to industry standards, a good PCB must first meet the performance needs of users, and at the same time, it can also meet the standard in terms of reliability, and it is best to have a certain advantage in cost. Of course, for different products, the emphasis on the above three points will be different.
At present, due to the shortage of chips and the price increase lasting for a long time, many domestic electronics companies have responded by localizing or replacing chips. A large number of products require PCB revision designs. Some PCB factories have also promoted many companies and universities through free proofing. The enthusiasm of the teachers and students for PCB proofing has brought a certain degree of growth to the PCB manufacturing market.
Although the demand for PCBs in new energy vehicles has greatly increased, due to the use of large-capacity batteries in new energy vehicles, the current in the circuit becomes larger, current-carrying design and thermal design have become critical, and reliability is more important for PCBs. Design, but from the performance point of view, the point that affects the reliability the most is heat. Therefore, it is necessary to control the heat from the IC package, through the PCB, to the complete product under the operating environment.
In the field of display technology, especially the next generation of active light-emitting LEDs, the backlight module is usually as large as the screen, and the PCB is as large. And this kind of display device is usually used in fields such as monitoring large screens and outdoor advertising screens, and the market demand is currently rising.
In the field of 5G and smart phones, 5G is mainly reflected in the design considerations of PCB materials and signal transmission quality. Compared with 4G, 5G has higher speed, larger capacity, and lower latency. The "heating" problem that also brings to 5G base stations and terminals has attracted much attention from the industry. In the field of smart phones, 5G mobile phones are continuously upgraded in the direction of high performance, high screen quality, high integration, lightness and thinness. Compared with the 4G era, the amount of heat generation has increased significantly, and the demand for heat dissipation has also increased significantly. In the circuit design of the 5G field, there is an urgent need for more energy-efficient devices and more effective PCB heat dissipation solutions.
It can be seen that with the current development of new energy vehicles, 5G, new display technology, semiconductor testing and other fields, the domestic market’s demand for PCBs is also rising, and due to technological upgrades, PCB design has also been advanced. Require.