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The abbreviation of Flexible Printed Circuit is FPC, also known as flexible circuit board, flexible circuit board, flexible circuit board, flexible printed circuit board, flexible circuit board, or FPC for short. It has high wiring density, good flexibility, Features of bending, light weight and thin thickness.
Mainly used in notebook computers, mobile phones, LCM, LCD, PDA, digital cameras and many other products.
Features:
Today's flexible boards (FPC) have more and more complex shapes and shorter delivery times. Traditional flexible board processing technology uses machining methods to open the cover film window and process the appearance, which can no longer meet the requirements of the market. Complicated, for small and medium batches, the cost is considerable; thirdly, due to the shape and size of the particularly complex opening, it is becoming more and more difficult to process with molds. TopWin's MicroVector equipment uses high-power ultraviolet lasers to process flexible circuit boards, which are suitable for small batch and mass production, and has been recognized by the market in terms of quality, price, and speed.
Laser cutting directly according to CAD data is more convenient and faster, and can greatly shorten the delivery time;
Using galvanometer scanning and linear motor two-dimensional worktable combined movement mode, does not increase the processing difficulty due to complex shapes and tortuous paths;
The MicroVector device uses vectors to describe the path of the laser, making it smoother. The contour edges of the cover film cut by such a laser system are neat and round, smooth, without burrs, and without glue overflow. It is inevitable to open the window with molds and other machining methods. There will be burrs and glue overflow after punching. Such burrs and glue overflow are difficult to remove after bonding and pressing on the pads, which will directly affect the subsequent The quality of the coating.
Flexible board sample processing often results in changes in the cover film window due to customer needs to modify the wiring and pad positions. Using traditional methods, it is necessary to replace or modify the mold. With the MicroVector system, this problem can be solved, because you only need to import the modified CAD data into the MicroVector software system to easily and quickly process the cover film you want to open the window graphics, which will reduce the time and cost. For you to win market competition opportunities.
MicroVector equipment integrates CNC technology, laser technology, software technology and other high-tech optomechanical technology. It has the characteristics of high flexibility, high precision, high speed and other advanced manufacturing technologies, which can enable circuit board manufacturers to be technically, economically, and time-sensitive. Change the traditional processing and delivery methods of flexible boards in terms of upper and autonomy.
Application areas:
MicroVector UV laser equipment can be used in many areas of flexible board production, including FPC profile cutting, contour cutting, drilling, cover film opening and so on.
