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FPC is the abbreviation of Flexible Printed Circuit in English, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, abbreviated as soft board or FPC; this kind of circuit board has the advantages of high wiring density, light weight, thin thickness, etc. . It is widely used in mobile phones, notebook computers, PDAs, digital video cameras, LCMs and many other products.
FPC flexible circuit board features: FPC flexible circuit board has the characteristics of high wiring density, lightweight, thin thickness and so on.
The use of FPC flexible circuit board
FPC flexible circuit boards are used in electronic products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and so on. FPC flexible circuit board is a highly reliable and excellent flexible printed circuit made of polyimide or polyester film as the base material. According to the combination of base material and copper foil, flexible circuit boards can be divided into two types: flexible boards with glue and flexible boards without glue. Among them,
the price of the glueless flexible board is much higher than that of the glued flexible board, but its flexibility, the bonding force of the copper foil and the substrate, and the flatness of the pad are also better than the glued flexible board. Therefore, it is generally only used in those occasions with high requirements; due to the high price of flexible boards with glue, most of the flexible boards on the market are still flexible boards with glue. Since the flexible board is mainly used in occasions that need to be bent, if the design or process is unreasonable, defects such as micro-cracks and open welding are likely to occur. The structure of the flexible circuit board and its special requirements in design and process are as follows:
FPC flexible board structure
is divided into single-layer boards, double-layer boards, and multi-layer boards according to the number of layers. The structure of the single-layer board is the simplest flexible board. Usually the base material + transparent glue + copper foil is a set of purchased raw materials, and the protective film + transparent glue is another purchased raw material. First, the copper foil needs to be etched and other processes to obtain the required circuits, and the protective film needs to be drilled to expose the corresponding pads. After cleaning, use the rolling method to combine the two. Then the exposed pad part is electroplated with gold or tin for protection. In this way, the slab is ready. Generally, small circuit boards of corresponding shapes are also stamped. There are also solder masks directly printed on the copper foil without a protective film so that the cost will be lower, but the mechanical strength of the circuit board will be worse. Unless the strength requirements are not high but the price needs to be as low as possible, it is best to apply a protective film method.
The structure of the double-layer board is that when the circuit is too complicated, the single-layer board cannot be wired or copper foil is needed for grounding shielding, it is necessary to use a double-layer board or even a multilayer board. The most typical difference between a multi-layer board and a single-layer board is the addition of a via structure to connect each layer of copper foil. The first processing technology of general substrate + transparent glue + copper foil is to make vias. First drill holes on the substrate and copper foil, and then plate a certain thickness of copper after cleaning, and the vias are completed. The subsequent production process is almost the same as the single-layer board.
FPC Application field
MP3, MP4 players, portable CD players, home VCDs, DVDs, digital cameras, cell phones and cell phone batteries, medical, automotive, aerospace and military fields. Flexible copper clad laminates (FPC) with flexible functions and based on epoxy resin are becoming more and more widely used due to their special functions, and are becoming an important variety of epoxy resin-based copper clad laminates. But our country started late and has yet to catch up.
Epoxy flexible printed circuit boards have experienced more than 30 years of development since their industrial production. From the 1970s to the real industrial mass production, until the late 1980s, due to the advent and application of a new type of polyimide film material, flexible printed circuit boards made the FPC a non-adhesive type. FPC (generally referred to as "two-layer FPC"). In the 1990s, a photosensitive cover film corresponding to high-density circuits was developed in the world, which caused a great change in the design of FPC. Due to the development of new application areas, the concept of its product form has undergone a lot of changes, and it has been expanded to include a larger range of substrates for TAB and COB. The high-density FPC that emerged in the second half of the 1990s began to enter large-scale industrial production. Its circuit patterns are rapidly developing to a more subtle degree, and the market demand for high-density FPC is also growing rapidly.
