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PCB Technical

PCB Technical - PCB design inspection process

PCB Technical

PCB Technical - PCB design inspection process

PCB design inspection process

2021-10-22
View:433
Author:Jack

In the PCB manufacturing industry, after PCB process designers have completed the PCB design through EDA software, do they need to check the design results? The answer is yes, and there is more than one test.

The first is DRC inspection. DRC inspection is also called PCB design rule inspection, which is used in PCB design software (EDA) for real-time inspection and discovery of designs that are inconsistent with predetermined design specifications during the PCB Layout process. It is the starting point to ensure the correctness of the design and meet the conventional design specifications, and it is an indispensable part of the PCB design. Based on the role and purpose of DRC, its inspection items generally do not exceed 100 inspection items.
The second is DFM inspection. DFM inspection is also called design analysis for manufacturability, which is based on PCB design data through real three-dimensional component models and actual manufacturing process simulations, comprehensive manufacturability design reviews of PCB and PCBA before manufacturing, and design defects are found in the first time Or insufficient, process difficulties, manufacturing risks, PCB design and process mismatch factors, etc., to ensure that the design and process capabilities are fully matched, which substantially reduces the number of product trials, saves PCB board production costs, and improves product reliability.
These two kinds of tests are different tests designed at different stages, and one is indispensable.

PCB process designers

DRC is PCB design software used to ensure that it does not violate the specifications (constraints) of its own design. Meeting DRC inspection is the most basic requirement of PCB design. Meeting DRC does not mean that it must meet the manufacturability requirements.
DFM is a bridge between PCB design and manufacturing process. It belongs to the category of process design. Through it, you can find mismatch factors between design and manufacturing process, evaluate manufacturing difficulty, manufacturing risk, etc. These are the DRC in PCB design software. Covered.
There is no conflict between the DFM itself and the DRC inspection. The problems solved by the two are different, the stage is different, and the ultimate goal is also different. Therefore, the difference is also very obvious.
The difference between DRC and DFM
Metaware library difference
EDA component library = pad package library
DFM component library = three-dimensional physical model
DFM: PCB + component model + process = assembly simulation
DFM: Real 3D simulation assembly simulation analysis
DFM: Comprehensive analysis rules
How can X-ray inspection technology be better used in PCBA? Let us first understand the development of PCBA industry. With the development of high-density packaging technology, it also brings new challenges to test technology. In order to meet new challenges, many new technologies are also emerging. X-ray inspection technology is a very important way. Through X-ray inspection, the quality of BGA welding and assembly can be effectively controlled. The current X-ray inspection system is not only used in laboratory analysis, but has been specifically used in many industries of circuit board production. The PCBA industry is one of them. To some extent, X-ray inspection technology is a necessary means to ensure the quality of electronic assembly.
From the perspective of the PCBA industry, BGA testing is getting more and more attention. In order to ensure the quality of the invisible solder joints in the PCBA assembly process of such devices, X-ray testing is an indispensable and important tool. This is because X-ray inspection technology can penetrate the inside of the package and directly inspect the quality of the solder joints. As the packaging methods of semiconductor product components are becoming more and more miniaturized, this requires a better X-ray
Testing equipment to ensure the needs of miniaturization testing of product components.