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PCB Technical

PCB Technical - What should I prepare for HDI board proofing?

PCB Technical

PCB Technical - What should I prepare for HDI board proofing?

What should I prepare for HDI board proofing?

2021-10-16
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Author:Aure

What should I prepare for HDI board proofing?


With the continuous development of current electronic products in the direction of high density and high precision, the requirements for product parts are becoming more and more stringent. The emergence of HDI boards meets the electronic performance and high efficiency indicators of these categories at the same time. It is present in popular electronic products, digital cameras and even the automotive industry.


So what is HDI board proofing? What is an HDI board? It is actually a high-density circuit board that contains inner and outer circuits, which are then processed by drilling technology and metallization in the holes, so as to realize the interconnection function of the internal circuits of each layer. Its appearance on the other hand is to increase the density of CPB, but HDI has a higher advantage than the latter.


high-density circuit board

In the proofing of HDI boards, we must first make planning and design, and do a good job of product system separation, which is a very important step. In the initial stage, the HDI panel should be divided into systems. Since its interconnection technology is constantly changing, this will cause many production challenges to be faced and solved. If product separation is carried out, the characteristics will be converted to system requirements and specifications., It is easier to take advantage of HDI. The next step is the layout of the HDI circuit board. This includes balanced analysis and density requirements. As long as this step is properly deployed, the subsequent HDI board proofing procedures will also reduce a lot of unnecessary procedures and reduce costs. Another important consideration in the HDI board proofing process is the wiring capacity, which refers to the length of the line that can be connected to all parts. There are three main factors that affect it, one is the line width spacing, reserved space, etc. It is the basis of each layer of circuit graphics; the second is the number of layers and buried holes, etc., which must follow the established rules. Under normal circumstances, this step will be more complicated, which requires the operator to have rich experience and Only theoretical knowledge can lay a good foundation for subsequent proofing. The third thing to pay attention to is efficiency. In the design, the available area and the percentage of use should be reserved.

After the HDI board proofing is completed, using auxiliary methods and evaluating density benefits can more accurately estimate production costs. Under certain circumstances, it can also help solve the problems that will occur in the later stage. It can greatly increase the use effect of HDI and make it Can play its real role. It is also necessary to choose a good principle when proofing. In most cases, technicians prefer to choose resin materials as the basis because they have excellent adhesion, good heat resistance and appropriate electrical conductivity. Coupled with the relatively low cost, it can better reflect the high cost performance.