PCB Technical - Four characteristics of PCB industry development

From the development process of the domestic market of the PCB industry, in the past ten years, the global PCB has continued to migrate to Asia, especially mainland China, and mainland China has quickly become a major producer of electronic products and PCBs. Due to the domestic market potential and manufacturing advantages, China has attracted foreign investment, which has prompted the PCB industry in mainland China to grow at multiples in just a few years. At present, in addition to the output value and sales of China’s PCB industry, the industry leads the electronic component manufacturing industry. The development of the company also has the following four brief characteristics:

1. Market expansion and wide product use

PCB is a key interconnection of electronic equipment, and any electronic equipment needs to be equipped. Especially in the current electronic information technology, data processing and communication equipment put forward higher standards and more requirements for PCBs.

2. Industry expansion

The printed circuit industry has developed from a single circuit board processing to electronic circuit components, including the assembly of electronic circuit components and the development of electronic manufacturing services (EMS). Printed board manufacturing companies will provide electronic assembly services according to customer requirements.

Three, product grades continue to improve

At present, ordinary PCBs are still suitable for general electronic equipment, and the new generation of electronic equipment requires higher density circuit boards, which are suitable for the requirements of multi-function, miniaturization and light weight of the whole machine. Mainly to develop multi-layer boards, flexible boards and high-density interconnection (HDI/BUM) substrates and IC packaging (BGA, CSP) substrates.

4. Further improvement of production technology to promote the development of high-end equipment manufacturing industry

In order to process high-density PCB s, new technology must be adopted in many aspects such as pattern production, hole processing, surface coating, and inspection. Blind/buried vias and build-up methods will be commonly used. The development of new materials is suitable for HDI/BUM boards and IC packaging substrates, with better electrical and mechanical properties, and a large number of new laser and photoelectric automation equipment will be introduced.

The status quo of PCB industry development in China

According to Prismark research data, the circuit board industry has entered a steady growth cycle. In 2014, the global output value reached 57.4 billion U.S. dollars, with a growth rate of approximately 2.3%. It is estimated that it will grow by about 3% in 2015 to reach an output scale of 59 billion U.S. dollars. In 2014, China's PCB output value reached US$26.1 billion, an increase of 6.0% year-on-year, the largest increase in the world, and a global proportion of 45.5%. It is predicted that by 2019, China's PCB will account for more than 50% of the global proportion.

China's printed circuit board industry also presents a fragmented competition pattern, with small companies in general and a small number of large PCB companies. However, the breakdown of Prismark data shows that in 2014, the domestic PCB output value of mainland China was US$8.443 billion, a year-on-year growth rate of 11.4% (US$7.581 billion in 2013). With the development of the terminal electronics market, the mainland PCB has been steadily developing and advancing rapidly, and its influence in the global PCB field is increasing.