PCB Technical - PCB manufacturer: the focus of pre-manufacturing engineering design of multilayer circuit boards

PCB manufacturer: the focus of pre-manufacturing engineering design of multilayer circuit boards

First, the pre-manufacturing engineering design of multi-layer circuit boards is heavy
After the product design and circuit design of the electronic equipment are completed, the parts production, PCBA board assembly and connection steps will be carried out. After testing and confirming the function, the overall electronic equipment manufacturing is complete. When designing the circuit board, the designed electronic components will be arranged in the expected area in CAD, and then the component telecommunication transmission planning will be carried out, and then the manufacturing data and test specification documents required for the manufacture of the circuit board will be produced for each section The manufacturer follows.

The industrial attributes of PCB processing are mostly OEM, which is to produce Bare Boards commissioned by customers. Of course, some companies have their own circuit board design, blank board production and assembly (Assembly) Turn-Keya54 business, etc., even within the same product manufacturing company, but the overall proportion is still a minority . In the early stage of circuit board production, as long as the original materials provided by the customer such as: drawing, artwork, specification, etc., and then manually flip, typesetting, tape and other operations, it can be produced. However, in recent years, as electronic products have become lighter, thinner, shorter and smaller, PCB manufacturing has faced several challenges such as thin board, high density, high performance, high speed, shortened product cycle, cost pressure, and precision.

In the past, light tables, pen sharps, stickers, and cameras were used as pre-production tools, but now they have been replaced by computers, working software, and laser plotters. In the past, manual typesetting was used, or Micro-Modifier m was required to correct the size and other time-consuming and labor-intensive operations. Today, as long as CAM (Computer Aided Manufacturing) personnel obtain customer design data, they can automatically typeset and follow the design rules within a few hours. Varying different production conditions. The DFM (Design For Manufacturing^56 system) can simultaneously output data such as drilling, forming, and testing fixtures.

The scope of consideration of pre-production engineering design should cover different requirements such as component information, assembly methods, material selection, wiring rules, manufacturing procedures, etc., and due to the trend of lightness, thinness, shortness, smallness, high functionality and mobility. With the expectation of increasing design freedom, multilayer circuit boards have become a necessary design for most electronic products. As the packaging structure of semiconductor components changes, in addition to the old through-hole components and DIP, QFP, there are also diversified matrix packages such as BGA, PGA, CSP, and MCM. After taking these into consideration, all the information is sorted out and filled into the design drawing of the circuit board to produce various CAM data for the manufacture of the circuit board.

Two necessary documents before multi-layer circuit board system
The circuit board customer commissioned to manufacture, must provide the relevant information shown in Table 1 for the blank board production. In addition to the necessary items listed in the table, sometimes the customer will provide a sample, a part drawing, and a warranty (for example, to ensure that the raw materials and consumables used in the manufacturing process do not contain certain toxic substances). Manufacturers must judge the importance of these additional information to clarify and use them.

Of course, for the product maker, he will have a different understanding of the circuit board used in the product, so he will consider the size, function, power supply mode, heat dissipation method, etc. of the assembly in more detail. If the circuit board manufacturer can further participate in the overall function planning, it will be of greater help to product production.

As semiconductors become smaller and denser, the energy density of electronic products will inevitably increase. Therefore, the design of heat dissipation is the key to the smooth operation of the product. At present, the heat dissipation methods of many electronic products have been included in the circuit board structure design. consider.

Three design content data review
Faced with the numerous materials provided by customers, the design engineer must review and confirm the materials before manufacturing to facilitate the subsequent design and manufacturing, and generally focus on the review of written materials.