PCB Technical - What are the factors that affect the quality of board soldering in circuit board factories

What are the factors that affect the quality of board soldering in circuit board factories

Circuit boards are required in electronic products. The tin plate in the circuit board factory is also a process chosen by most users. The following editor of the circuit board factory will analyze the conditions of the soldering technology of the circuit board:

The quality of soldering mainly depends on the ability of the solder to wet the surface of the weldment, that is, the wettability of the two metal materials is the solderability. If the weldability of the weldment is poor, it is impossible to weld qualified solder joints. Solderability refers to the performance of weldment and solder to form a good bond under the action of appropriate temperature and flux.

Welding time: refers to the time required to perform physical and chemical changes during the welding process. PCB board welding time should be appropriate, too long will damage the welding parts and components, too short will not meet the requirements.

There are many types of fluxes, and their effects are different. Different fluxes should be selected according to different welding processes and materials of weldments. If the amount of flux is too much, the side effects of flux residue will increase. If the amount of flux is too small, the effect of flux will be poor. The flux used for soldering electronic products usually adopts rosin flux. The rosin flux is non-corrosive, removes oxidation, enhances the fluidity of the solder, helps to wet the soldering surface, and makes the solder joints bright and beautiful.

Thermal energy is an indispensable condition for welding. During soldering, the function of heat energy is to diffuse the solder to the component and raise the temperature of the weldment to an appropriate soldering temperature in order to form a metal alloy with the solder.

In order to achieve a good combination of solder and weldment, the surface of the weldment must be kept clean. Even for weldments with good weldability, if there is an oxide layer, dust and oil on the surface of the weldment. The staff of the circuit board factory must clean up before welding, otherwise the formation of the alloy layer around the weldment will be affected, and the welding quality cannot be guaranteed.