Технология PCB - PCB изготовление высокочастотных схем

Определения высокочастотный печатная платаfor circuit board production. а высокочастотная пластина refers to a special circuit board with a higher electromagnetic frequency, which is used in the fields of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter) PCB is a панель производственных схем on microwave base copper-clad boards using part of the process of ordinary rigid circuit board manufacturing methods or using special processing methods. Вообще говоря, a высокочастотная пластина схемная плата, определяемая как частота выше 1ггц!
With the rapid development of science and technology, more and more equipment is designed for applications in the microwave frequency band (>1GHZ) or even in the millimeter wave field (30GHZ). это значит, что частота растёт., and the circuit board is The requirements for materials are getting higher and higher. например, the substrate material needs to have excellent electrical properties, химическая устойчивость, and the loss on the substrate with the increase of the power signal frequency is very small, поэтому высокочастотная пластина is highlighted. 2. PCB высокочастотная пластина application fields: mobile communication products; power amplifiers, малошумящий усилитель, сорт.; пассивный элемент типа делителя мощности, couplers, дуплекс, filters, сорт.; automotive anti-collision systems, спутниковая система, radio systems, и в других областях, The high frequency of electronic equipment is the development trend.

PCB применение высокочастотной панели мобильных средств связи; усилитель мощности, малошумящий усилитель, etc.; пассивный элемент типа делителя мощности, couplers, дуплекс, filters, etc.; automotive anti-collision systems, спутниковая система, radio systems and other fields, электронно - высокочастотное оборудование является тенденцией развития.
Classification of high frequency board powder ceramic filled thermosetting material
A. Производители платы
4350B/4003C from Rogers
Arlon's 25N/25FR
Taconic's TLG series
B. Circuit board processing method:
The processing process is similar to epoxy resin/glass woven cloth (FR4), except that the sheet is relatively brittle and easy to break. когда сверление и гонг, the life of the drill tip and gong knife is reduced by 20%. PTFE (polytetrafluoroethylene) material
A. Manufacturer: RO3000 series, RT (серия игр), TMM series from Rogers
Arlon's AD/AR (серия игр), IsoClad series, CuClad series
Taconic's RF series, TLX series, TLY series
Taixing Microwave's F4B, F4BM, F4BK, TP-2
B. способ обработки: 1. Cutting: The protective film must be kept for cutting to prevent scratches and creasing
2. Circuit board drilling
1. Use a brand new drill tip (standard 130), one by one is the best, the pressure of the presser foot is 40psi
2. алюминиевый лист, and then the PTFE plate is tightened with a 1mm melamine backing plate
3. после бурения, use an air gun to blow out the dust in the hole
4. Use the most stable drilling rig and drilling parameters (basically the smaller the hole, the faster the drilling speed, Чем меньше нагрузка на кристалл, the smaller the return speed)
3. Hole processing of the circuit board
Plasma treatment or sodium naphthalene activation treatment is conducive to hole metallization
4. Circuit board PTH sinking copper
1 After the micro-etching (the micro-etching rate has been controlled by 20 microinches), the PTH pulls from the de-oiler cylinder to enter the board
2 If necessary, через второй PTH, just start the board from the expected cylinder
5. Circuit board solder mask
1 Pre-treatment: Use acidic plate washing instead of mechanical grinding plate
2 Baking plate after pretreatment (90 degree Celsius, 30min), brush with green oil to cure
3 Baking plates in three stages: one section of 80 degree Celsius, 100 градусов по цельсию, 150 градусов по цельсию, each for 30 minutes (if you find that the substrate surface is oily, you can rework: wash off the green oil and reactivate it)
6. Circuit board gong board
Lay the white paper on the circuit surface of the PTFE board, и прижать к доске FR - 4 или бакелитовой плитке толщиной 1.протравка на 0 мм для удаления меди, as shown in the figure: высокочастотная пластина lamination method
The burrs on the back of the gong board need to be carefully trimmed by hand to prevent damage to the substrate and copper surface, затем отделить серной бумагой большого размера, & внешний осмотр. To reduce burrs, Дело в том, что процесс гонга должен иметь хороший эффект.
Process flow NPTH's PTFE sheet processing flow
Cutting-Drilling-Dry Film-Inspection-Etching-Erosion Inspection-Solder Mask-Characters-Spray Tin-Forming-Testing-Final Inspection-Packaging-Shipment
PTH's PTFE plate processing flow
Cutting-drilling-hole treatment (plasma treatment or sodium naphthalene activation treatment)-copper immersion-board electricity-dry film-inspection-diagram electricity-etching-corrosion inspection-solder mask-character-spray tin-molding-test-final Inspection-Packaging-Shipping

Summarize the difficulties of высокочастотная пластина processing
1. Immersion copper: the hole wall is not easy to be copper
2. управление линейными щелями и трахомой при передаче карт, etching, line width
3. Green oil process: green oil adhesion, green oil foaming control
4. Strictly control board surface scratches in each process.