Новости PCB - качество платы и меры по улучшению

Common circuit board quality problems and improvement measures in многослойный PCBметод защищённой сварки

In the многослойный PCBsolder mask process, as smart as you may encounter various problems in the production of circuit boards, the common ones are as follows:

Problem: White spots in printing

Reason 1: The многослойная печатная платаhas white spots

Improvement measures: the thinner does not match, use the matched thinner [please use the company's supporting thinner]

Reason 2: The circuit board is dissolved in the sealing tape

Improvement measures: use white paper to seal the net

problem: sticky film

Reason 1: The circuit board ink is not dried

Improvement measures: check the degree of ink drying

Reason 2: Multi-layer PCB vacuum is too strong

Improvement measures: check the vacuum system (the air guide strip may not be added)

Problem: Poor exposure

Reason 1: Poor vacuum

Improvement measures: check the vacuum system

Reason 2: Multi-layer PCB exposure energy is inappropriate

Improvement measures: adjust the appropriate exposure energy

Reason 3: The temperature of the многослойный PCBexposure machine is too high

Improvement measures: check the temperature of the exposure machine (below 26)

Problem: The ink does not dry out

Reason 1: The exhaust air of the circuit board oven is not good

Improvement measures: check the exhaust air condition of the oven

Reason 2: Less thinner

Improvement measures: increase thinner, fully dilute

Reason 3: The ink is too thick

Improvement measures: appropriately adjust the ink thickness

Reason 4: The thinner dries too slowly

Improvement measures: use matching thinner [please use company supporting thinner]

Reason 5: The oven temperature is not enough

Improvement measures: Determine whether the actual temperature of the oven reaches the required temperature of the product

Problem: The development is not clean

Reason 1: It takes too long after printing

Improvement measures: control the storage time within 24 hours

Reason 2: The ink runs out before development

Improvement measures: work in the darkroom before developing (the fluorescent lamp is wrapped in yellow paper)

Reason 3: Development time is too short

Improvement measures: extend the development time

Reason 4: Exposure energy is too high

Improvement measures: Adjust exposure energy

Reason 5: Multi-layer circuit board ink is over-baked

Improvement measures: adjust the baking parameters, not to burn to death

Reason 6: Ink mixing is uneven

Improvement measures: Stir the ink evenly before the printed circuit board

Reason 7: Not enough developing potion

Improvement measures: the temperature is not enough to check the concentration and temperature of the medicine

Reason 8: The thinner does not match

Improvement measures: use matching thinner [please use company supporting thinner]

Problem: Excessive development (corrosion test)

Reason 1: The concentration of the potion is too high and the temperature is too high

Improvement measures: reduce the concentration and temperature of the potion

Reason 2: Development time is too long

Improvement measures: shorten the development time

Reason 3: Insufficient exposure energy

Improvement measures: Increase exposure energy

Reason 4: The developing water pressure is too large

Improvement measures: lower the developing water pressure

Reason 5: Ink mixing is uneven

Improvement measures: Stir the ink evenly before printing

Reason 6: The ink is not dried

Improvement measures: Adjust the baking parameters, see the question [Ink does not dry]

Problem: Green Oil Bridge Broken Bridge

Reason 1: Insufficient exposure energy

Improvement measures: Increase exposure energy

Reason 2: The sheet is not handled properly

Improvement measures: check the treatment process

Reason 3: Too much pressure for developing and washing

Improvement measures: check the developing and washing pressure

Problem: Foaming on the tin

Reason 1: Excessive development

Improvement measures: improve the development parameters, see the problem [over development]

Reason 2: The pre-treatment of the board is not good, и поверхность жирная и пыльная.

Improvement measures: do a good job of pre-treatment of многослойный PCBboards to keep the surface clean

Reason 3: Insufficient exposure energy

Improvement measures: check the exposure energy and meet the ink usage requirements

Reason 4: Abnormal flux

Improvement measures: adjust flux

Reason 5: Insufficient post-bake

Improvement measures: Baking process after inspection

Problem: Poor upper tin

Reason 1: The development is not clean

Improvement measures: improve several factors of poor image development

Reason 2: Post-baking solvent contamination

Improvement measures: increase oven exhaust or machine cleaning before spraying tin

problem: post-baking and exploding oil

Reason 1: There is no segmented baking

Improvement measures: stage baking

Reason 2: Insufficient viscosity of многослойный PCBplug hole ink

Improvement measures: adjust plug hole ink viscosity

Problem: Ink matte

Reason 1: The thinner does not match

Improvement measures: use matching thinner [please use company supporting thinner]

Reason 2: Low exposure energy

Improvement measures: Increase exposure energy

Reason 3: Overdeveloped circuit board

Improvement measures: improve the development parameters, see the problem [over development]

Problem: Ink discoloration

Reason 1: Insufficient ink thickness

Improvement measures: increase ink thickness

Reason 2: Multilayer circuit board substrate oxidation

Improvement measures: check the pre-treatment process

Reason 3: The post-baking temperature is too high

Improvement measures: the time is too long to check the baking parameters

Problem: Ink adhesion is not strong

Reason 1: Ink type selection is inappropriate.

Меры по улучшению: замена подходящей чернила.

причина 2: тип чернил не выбран.

Improvement measures: Change to appropriate ink.

причина 3: время сушки, temperature is not correct, при сушке объем выхлопных газов слишком мал.

Improvement measures: use the correct temperature and time, увеличение выпуска.

Reason 4: The amount of additives is inappropriate or incorrect.

Меры по улучшению: корректировка дозы или переключение на другие добавки.

причина 5: высокая влажность.

Improvement measures: improve air dryness.

Problem: Blocking the Internet

Reason 1: Drying is too fast.

Меры по улучшению: добавление замедлителя осушки.

причина 2: печатание слишком медленно.

Меры по улучшению: повысить скорость, замедлить скорость осушки.

причина 3: высокая вязкость многослойных PCB чернил.

Меры по улучшению: добавить смазку для туши или сверхмедленной сушки.

обоснование 4: разбавитель не подходит.

Меры по улучшению: использовать выделенный разбавитель.

вопрос: просачивание, blur

Reason 1: The ink viscosity is too low.

Меры по улучшению: увеличение концентраций без добавки разбавителя.

причина 2: слишком большое давление на сетку.

Меры по улучшению: смягчение давления.

причина 3: плохая резиновая щетка.

Меры по улучшению: замена или изменение угла скребкового сита.

причина 4: расстояние между экраном и печатной поверхностью слишком большое или слишком маленькое.

Improvement measures: Adjust the spacing.

причина 5: растяжение шелковой сети уменьшилось.

Меры по улучшению: переработать новую версию экрана.

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