точная сборка PCB, высокочастотная PCB, высокоскоростная PCB, стандартная PCB, многослойная PCB и PCBA.
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The definition of circuit board production high frequency board
высокочастотная плата refers to a special circuit board with a higher electromagnetic frequency. It is used for high-frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). It is a microwave substrate The copper clad board is a circuit board produced by using part of the process of the ordinary rigid circuit board manufacturing method or using a special processing method. Вообще говоря, a high-frequency circuit board can be defined as a circuit board with a frequency above 1GHz!
с бурным развитием науки и техники, more and more equipment is designed for applications in the microwave frequency band (>1GHZ) or even in the millimeter wave field (30GHZ). это значит, что частота растёт., and the circuit board is The requirements for materials are getting higher and higher. например, the PCB substrate material needs to have excellent electrical properties, химическая устойчивость, and the loss on the substrate with the increase of the power signal frequency is very small, Поэтому важность этого плана высокочастотная пластина is highlighted. 2. PCB высокочастотная пластина область применения: продукты мобильной связи; усилитель мощности, low-noise amplifiers, сорт.; passive components such as power splitters, ответвитель, дуплекс, фильтр, сорт.; частотно - следящая предотвращения столкновения автомобилей, спутниковая система, радиосистема, и в других областях, высокочастотное развитие электронного оборудования.
высокочастотная плата PCB применение: мобильные средства связи; усилитель мощности, low-noise amplifiers, сорт.; passive components such as power splitters, ответвитель, duplexers, filters, etc.; automotive anti-collision systems, satellite systems, radio systems, и в других областях, The high frequency of electronic equipment is the development trend.
Classification of high frequency board powder ceramic filled thermosetting material
A. Circuit board manufacturer:
4350B/4003C from Rogers
Arlon's 25N/25FR
Taconic's TLG series
B. Circuit board processing method:
The processing process is similar to epoxy resin/glass woven cloth (FR4), except that the sheet is relatively brittle and easy to break. когда сверление и гонг, the life of the drill tip and gong knife is reduced by 20%. PTFE (polytetrafluoroethylene) material
A. изготовитель: серия RO3000, RT (серия игр), TMM series from Rogers
Arlon's AD/AR (серия игр), IsoClad series, CuClad series
Taconic's RF series, TLX (серия игр), TLY series
Taixing Microwave's F4B, F4BM, F4BK, TP-2
B. Processing method: 1. Cutting: The protective film must be kept for cutting to prevent scratches and creasing
2. Circuit board drilling
1. Use a brand new drill (standard 130), one by one is the best, the pressure of the presser foot is 40psi
2. алюминиевый лист, and then the PTFE plate is tightened with a 1mm melamine backing plate
3. после бурения, use an air gun to blow out the dust in the hole
4. Use the most stable drilling rig and drilling parameters (basically the smaller the hole, скорость бурения, the smaller the Chip load, the smaller the return speed)
3. Hole processing of the circuit board
Plasma treatment or sodium naphthalene activation treatment is conducive to hole metallization
4. Circuit board PTH sinking copper
1 After the micro-etching (the micro-etching rate has been controlled by 20 microinches), the PTH pulls from the de-oiler cylinder to enter the board
2 If necessary, go through the second PTH, just start the board from the expected cylinder
5. Circuit board solder mask
1 Pre-treatment: Use acidic plate washing instead of mechanical grinding plate
2 Baking plate after pretreatment (90, 30min), brush with green oil to cure
3 Baking plates in three stages: one section of 80, божество, божество, 150, each for 30 minutes (if you find that the substrate surface is oily, you can rework: wash off the green oil and reactivate it)
6. Circuit board gong board
Lay the white paper on the circuit surface of the PTFE board, и прижать к доске FR - 4 или бакелитовой плитке толщиной 1.0MM etched to remove the copper, Как показано на диаграмме: высокочастотная пластина lamination method
The burrs on the back of the gong board need to be carefully trimmed by hand to prevent damage to the substrate and copper surface, затем отделить серной бумагой большого размера, and visually inspected. уменьшить заусенец, Дело в том, что процесс гонга должен иметь хороший эффект.
Process flow NPTH's PTFE sheet processing flow
Cutting-Drilling-Dry Film-Inspection-Etching-Erosion Inspection-Solder Mask-Characters-Spray Tin-Forming-Testing-Final Inspection-Packaging-Shipment
PTH's PTFE plate processing flow
Cutting-drilling-hole treatment (plasma treatment or sodium naphthalene activation treatment)-copper immersion-board electricity-dry film-inspection-diagram electricity-etching-corrosion inspection-solder mask-character-spray tin-molding-test-final Inspection-Packaging-Shipping
Summarize the difficulties of high-frequency circuit board processing
1. Immersion copper: the hole wall is not easy to be copper
2. управление линейными щелями и трахомой при передаче карт, etching, line width
3. технология зелёного масла: прилипание зелёного масла, green oil foaming control
4. штриховка на доске.
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