PCBA Tech - How SMT prevents bridging and environmental impact

How to prevent bridging in SMT patch processing?

SMT chip processing is currently the most popular technology and process in the electronic assembly industry. It is a way to install leadless or short lead surface assembly components (SMC/SMD for short, chip components in Chinese). Circuit assembly technology in which the surface of the circuit board or the surface of other substrates is soldered and assembled by methods such as reflow soldering or dip soldering.

So how does SMT chip processing prevent bridging? The following editor will analyze and introduce for everyone:

First: improve the activity of the flux;

Second: increase the temperature of the solder;

Third: increase the preheating temperature of the PCB and increase the wetting performance of the pad;

Fourth: Use components/PCB with good solderability;

Fifth: Remove harmful impurities and reduce the cohesion of the solder to facilitate the separation of the solder between the two solder joints.

How does the environment affect the processing of SMT patches?

The impact of the environment on SMT patch processing: With the prosperity of the electronics industry, there will be more and more orders for smt patch processing, and for many companies outsourcing smt processing business, they can actually understand the workshop environment of the contracting company. Because the working environment is one of the standards used to measure the SMT processing technology, and today I will talk about the environmental requirements of the SMT processing technology.

First, it is the so-called details that determine success or failure. Therefore, it is often possible to judge the processing level of the company through the environment of the SMT processing workshop. First of all, the power supply requirement is that the power of the power supply should be more than twice the power consumption., And if it is a single-phase power supply, it is 220±10% of the power supply, and if it is a three-phase power supply, it should be 380±10% of the power supply.

Second, there must be ventilation equipment in the workshop of SMT processing technology, because reflow soldering equipment and wave soldering equipment need to be equipped with exhaust fans, and the exhaust pipe of all hot blast stoves should have a minimum flow rate of 500 Cubic feet per minute will do.

Third, the SMT processing technology also has requirements for the temperature of the environment. In most cases, it is best to be between 20 degrees Celsius and 26 degrees Celsius. Most workshops basically maintain the range of 17 degrees Celsius to 28 degrees Celsius, and the humidity should be at the same time. About 70% is the best. If the workshop is too dry, dust will easily appear, which is very detrimental to the welding operation.

Fourth, the anti-static measures that need to be paid attention to in the SMT processing workshop, for example, the staff should wear anti-static overalls and bracelets, and the anti-static printed circuit board racks, etc. These are all must-have products.