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SMT chip plug-in processing has the advantages of high reliability and low solder joint defect rate, which can reduce external interference to the circuit board, which is a very beneficial link to realize automation and increase production. At the same time, it can also save manpower, and the saved production requires a lot of resources.
Now, no matter what you do, you need efficiency. SMT patch plug-in processing can save human resources and improve efficiency. This technology will definitely be accepted by this industry, and science and technology are developing rapidly. No matter what industry, if it cannot adapt well to the environment, it will be eliminated, and only when it is good enough will it be left behind.
Electronic products are getting smaller and smaller, and some of the patch plug-ins we used before cannot be reduced. Now the functions of this product will be more complete. Traditional circuits can't meet these requirements. Using SMT chip plug-in processing method can produce a large number of products. The entire production is automated, which can reduce costs, have good quality, meet market needs, and improve market competitiveness.
The use of SMT chip plug-in processing technology can meet the chip plug-in processing of various electronic components. Many electrical appliances are manufactured in this way, and the whole process is relatively simple. Professional SMD processing is mainly used for insulating materials of some large integrated circuits and semiconductors.
Its density is relatively high and its mass is relatively small. Its total volume and weight account for about 0.1, which is traditionally common. Its volume is reduced by about half and its weight is reduced by about 60%. Its reliability is quite high, and has a certain anti-vibration ability. Using these characteristics, electromagnetic and radiation interference can be reduced, and the utilization rate of raw materials can be greatly improved.
And it can reduce energy, reduce the frequency of equipment use, reduce the time of manual work, and greatly improve work efficiency. Therefore, many coastal areas use this professional patch processing technology, and electronic processing has been vigorously developed. After this technology is put into production, only a small amount of manpower can be used to complete complex tasks, which is an important step in electronic production.
What is the bad welding phenomenon in PCBA processing factory
PCBA processing is based on PCB design and production materials. Excellent PCB design is conducive to subsequent PCBA processing. Incomplete design will affect the processing process and even affect product quality. Then the bad welding phenomenon in professional PCBA processing is what:
1. There are holes on the surface of the spot welding during the PCBA processing plant: mainly because the gap between the wire and the socket is too large.
2. The solder wire is not the same: this problem is usually caused by the quality of the flux and solder wire in PCBA production and insufficient heating. When the compressive strength of the spot welding is insufficient, it is easy to cause common failures when encountering external forces.
3. There are too few welding materials in PCBA processing plants: it is mainly caused by the premature removal of the welding rod. Poor spot welding has poor compressive strength and conductivity, and it is easy to cause common short-circuit failures in electronic equipment due to external forces.
4. Tip: The key reason is that the ferrochrome was extracted from the wrong direction during the SMT patch process, or the temperature was too high to increase the flux.
5. Spot welding whitening: usually caused by too high soldering iron temperature or too long heating time.
6. Welding layer peeling: The peeling state of the welding layer after high temperature can easily cause problems such as short circuit failure of electronic equipment.
7 PCBA processing plant cold welding machine: The surface of spot welding is like tofu. The key is that the temperature of the soldering iron is insufficient or the weldment is moved before the welding material is condensed. Poor spot welding has low compressive strength and poor electrical conductivity, which is a common fault that is easily caused by external forces to short-circuit electronic equipment.
8 There are cracks in the spot welding: the main reason is that the penetration of the welding wire is poor or the gap between the welding wire and the socket is too large. Poor spot welding can be turned on and off temporarily, but over time, electronic devices are prone to common short-circuit failures. Excessive welding material: The key is because the welding rod was not removed immediately.
