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Several standard issues that need to be paid attention to in PCBA processing operations:
(1) Joint standards for the development of electrostatic discharge control procedures, including the necessary design, establishment, implementation and maintenance of electrostatic discharge control procedures; according to the historical experience of certain military organizations and commercial organizations, treatment and protection have been carried out for the sensitive period of electrostatic discharge Provide guidance.
(2) PCB soldering technology evaluation manual, including all aspects of soldering PCB technology involving common soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering and infrared soldering.
(3) Semi-aqueous cleaning manual after PCB circuit board welding, including all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control, environmental and safety considerations.
(4) Desktop reference manual for through-hole solder joint evaluation of PCB circuit boards, detailed description of components, hole walls and soldering surface coverage according to standard requirements, in addition to computer-generated 3D graphics; also includes filling Tin, contact angle, tin dip, vertical filling, solder pad coverage, and numerous solder joint defects.
(5) PCB template design guidelines, which provide guidelines for the design and manufacture of solder paste and surface mount adhesive coating templates. The template design for the application of PCB circuit board surface mount technology is also discussed. Hole or flip chip component technology, including overprinting, double printing and staged template design.
(6) Aqueous cleaning manual for PCB circuit boards after soldering, describing the manufacturing residues, the types and properties of aqueous cleaning agents, the process of aqueous cleaning, equipment and techniques, quality control, environmental control, and staff safety and cleanliness determination And the cost of the measurement.
Several issues that must be understood in the processing of several DIP plug-ins
Dip plug-in processing is a product often processed by some PCB board patch processing plants, but for plug-in processing or PCBA processing, it is necessary to deeply understand the following issues:
First: Flux specification requirements one includes Appendix I, including technical indicators and classifications of rosin, resin, etc., organic and inorganic fluxes classified according to the halide content and activation degree in the flux; also includes the use of flux, Substances containing flux and low-residue flux used in no-clean processes.
Second: Electronic grade solder alloy, flux and non-flux solid solder specification requirements; electronic grade solder alloy, rod, ribbon, powder flux and non-flux solder, for the application of electronic solder, for Special electronic grade solder provides term naming, specification requirements and test methods.
Third: Guidelines for conductive surface coating adhesives, which provide guidance for the selection of conductive adhesives as solder alternatives in electronic manufacturing.
Fourth: General requirements for thermally conductive adhesives, including requirements and test methods for thermally conductive dielectrics that bond components on PCB circuit boards to appropriate positions.
Fifth: Specification requirements for solder paste in PCBA technology patch processing workshops, listing the characteristics and technical index requirements of solder paste, including test methods and metal content standards, as well as viscosity, collapse, solder ball, viscosity and Wetting properties of solder paste.
