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PCBA Tech

PCBA Tech - Precautions for pcba processing technology

PCBA Tech

PCBA Tech - Precautions for pcba processing technology

Precautions for pcba processing technology

2021-09-05
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Author:Aure

Precautions for PCBA processing technology

We understand the process of PCBA processing technology. Today we will introduce the points that need to be paid attention to during PCBA processing. Let's take a look at the specific content of PCBA processing technology attention.

1. Transportation: In order to prevent PCBA damage, the following packaging should be used during transportation:

An anti-static turnover box is generally used for the container; the isolation material is anti-static pearl cotton. The placement distance should be greater than 10mm between the PCB board and the board, between the PCB board and the box. The placement height must be more than 50mm away from the top surface of the turnover box to ensure that the turnover box is not pressed against the power supply, especially the power supply of the wire material.



Precautions for PCBA processing technology

Second,PCBA processing and washing requirements: the surface of the board should be clean and tidy, and there should be no tin beads, component pins, and stains. Especially at the solder joints of the plug-in surface, there should not be any dirt left by soldering. When washing the board, you must pay attention to the following devices: wires, connecting terminals, relays, switches, polyester capacitors and other easily corrosive devices, and the relay is strictly prohibited to be cleaned by ultrasonic.

3. All components are not allowed to go beyond the edge of the PCB board after installation.

4. When PCBA is processed through the furnace, because the pins of the plug-in components are washed by the tin flow, some plug-in components will be tilted after the furnace is soldered, causing the body of the component to exceed the silk screen frame, so the repair welding personnel after the tin furnace are required to do it Correct appropriately.

1. The horizontal floating high power resistor can be righted once, and the righting angle is not limited.
2. Horizontal floating diodes (such as DO-201AD packaged diodes) or other components with a component pin diameter greater than 1.2mm can be centered once, and the centering angle is less than 45°.
3. Vertical resistors, vertical diodes, ceramic capacitors, vertical fuses, varistors, thermistors, semiconductors (TO-220, TO-92, TO-247 packages), the bottom of the component body floating height is greater than 1mm It can be centered once, and the centering angle is less than 45°; if the float height of the component body is less than 1mm, you must use a soldering iron to melt the solder joints for centering, or replace with a new device.
4. In PCBA processing, electrolytic capacitors, manganese copper wires, inductors with skeletons or epoxy board bases, and transformers are not allowed to be centered in principle. Soldering is required once. If there is a tilt, it is required to use a soldering iron to melt the solder joints and then perform centering., Or replace with a new device

At this point, all the precautions in the PCBA processing process have been presented for you. Will there be a feeling of sudden enlightenment after reading it? Or will you be happy because you have a little more knowledge in the PCBA field? I sincerely hope that this article can provide you with a little help.