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1. The wiring should be as straight as possible, or a 45-degree polyline, to avoid electromagnetic radiation.
2. The lines between different layers should not be parallel as much as possible, so as not to form actual capacitance.
3. Connect the wires above 3 points, try to let the wires pass through each point in turn for easy testing, and keep the wire length as short as possible.
4. Try not to put wires between the pins, especially between and around the pins of integrated circuits
5. The ground wire and power wire are at least 10-15mil or more (for logic circuits).
6. Try to connect the ground polylines as much as possible to increase the grounding area. Try to be as neat as possible between lines.
7. Consider the structure of component placement. The positive and negative poles of SMD components should be marked at the package and at the end to avoid space conflicts.
8. Pay attention to the uniform discharge of components to facilitate installation, plug-in, and welding operations. The text is arranged in the current character layer, the position is reasonable, pay attention to the orientation, avoid being blocked, and facilitate production.
9. Put the functional block components together as much as possible, and the zebra strips and other components near the LCD should not be too close.
10. It is best not to place pads, over-empty, etc. under the battery holder. The size of PAD and VIL are reasonable.
11. At present, the printed board can be used for 4 to 5 mil wiring, but it is usually 6 mil line width, 8 mil line spacing, and 12/20 mil pads. The wiring should consider the influence of sink current, etc.
12. After the wiring is completed, carefully check whether each connection line (including NETLABLE) is really connected (lighting method can be used).
13. The oscillating circuit components should be as close as possible to the IC, and the oscillating circuit should be as far away as possible from the antenna and other vulnerable areas. Place a ground pad under the crystal oscillator.
14. Consider more methods such as reinforcement and hollowing out components to avoid excessive radiation sources.
15. The vias should be painted with green oil (set to negative double value).
16. PCB design process: A: design schematic diagram; B: confirm the principle; C: check whether the electrical connection is complete; D: check whether all components are packaged and whether the size is correct; E: place the components; F: check whether the position of the components is reasonable ( Printable 1:1 picture comparison); G: ground wire and power cord can be laid out first; H: check for flying wires (can be turned off other layers except the flying wire layer); I: optimize the wiring; J: check the complete wiring K: Compare the network tables to check for any omissions; L: Check the rules and see if there are any wrong marks that shouldn't be; M: Sort out the text description; N: Add the iconic text description of the board-making; O: Comprehensive inspection.
The above is an introduction to the introduction of multilayer PCB wiring techniques. Ipcb is also provided to PCB manufacturers and PCB manufacturing technology
