PCB News - SMT chip component thrust test standards and test methods

SMT chip component thrust test standards and test methods
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1. SMT chip component thrust test standard:
1,0603 greater than 0.8KG
2,0805 is greater than 1.0KG
3. 1206 is greater than 1.5KG
4. The diode is greater than 1.5KG
5. Transistor components are greater than 2.0KG
6. IC chip is greater than 3.0KG
7. The use of thrust timing requires that the thrust meter and the tested material be at an oblique angle of 30 degrees to 45 degrees to apply force, and the force can be achieved at a uniform speed and meet the above-specified standard requirements.

2. SMT chip component thrust test method:
1. After the production line is transferred to the production line, the IPQC needs to do the SMD component adhesion thrust test, and use the thrust meter to test the different specifications of the devices on the PCBA. The thrust meter needs to be reset to zero before the thrust test, so that the pointer points to "0". "Scale;
2. The use of thrust timing requires that the thrust meter and the tested material be at an oblique angle of 30 degrees to 45 degrees to apply force, and the force can be reached at a uniform speed and meet the specified standard requirements;
3. The tested good and bad products need to be recorded on the corresponding record sheet for inspection;
4. After the test, the defective product needs to be placed separately and can be pulled down after repairing and retesting;

Three, SMT patch component thrust test matters needing attention:
1. Do not apply force quickly during measurement to avoid damage to the device;
2. The thrust test standards of different devices are not specified by customers and can be implemented with reference to related quality standards or IPC general inspection standards.
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