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High density interconnect (HDI) printed circuit board
High density interconnect (HDI) printed circuit board is the use of the latest technology to increase the use of printed circuit boards in the same or smaller area. This has driven major advances in mobile phone and computer products, producing revolutionary new products. This includes touch-screen computers and 4G communications and military applications, such as avionics and intelligent military equipment.
H igh density interconnect (HDI) printed circuit boards are characterized by high density properties, including laser micropores, thin wires and high performance thin materials. This increased density supports more functions per unit area. High tech high density interconnect (HDI) printed circuit boards contain multi-layer stacked copper filled micropores (high-order HDI printed circuit boards), which can be used to create more complex interconnections. These very complex structures provide the necessary routing solutions for the large pin count chips used in today's high-tech products.
High density interconnect (HDI) printed circuit board
High density interconnection (HDI) architecture:
1 + N + 1 - a printed circuit board containing a high density interconnect layer.
I + N + I (I ≥ 2) - a printed circuit board containing two or more high-density interconnect layers. The micropores in different layers can be staggered or stacked. Multilayer stacked copper filled micropores are common in challenging designs.
High density interconnect board (HDI) - all layers of the printed circuit board are high-density interconnection layers, which allow the conductors on any layer of the printed circuit board to connect freely with each other through multi-layer stacked copper filled micropores ("any layer conductive holes"). This provides a reliable interconnection solution for highly complex large pin count components, such as CPU and GPU chips on handheld devices.
Advanced capability: microporous
Micropores are formed by laser drilling and are usually 0.006 "(150 μ m), 0.005" (125 μ m) or 0.004 "(100 μ m) in diameter. They are optically aligned with the corresponding pad diameter, which is usually 0.012" (300 μ m), 0.010 "(250 μ m) or 0.008" (200 μ m), so they can be optically aligned with the corresponding pad diameter, so that more wiring density can be achieved. The micropores can be directly designed on the pad or deviated from each other. They can be staggered or stacked. They can be filled with non-conductive resin and plated with copper cover on the surface or directly plated to fill the holes. When wiring fine pitch BGA, such as chips with pitch of 0.8 mm and below, micropore design is valuable.
In addition, interleaved micropores can be used when wiring 0.5 mm pitch elements; however, stacked micropores are required for micro BGA wiring (e.g., 0.4 mm, 0.3 mm, or 0.25 mm pitch elements) through inverted pyramid wiring technology.
Ipcb has many years of high density interconnect (HDI) product production experience, and is the pioneer of the second generation of micropores or stacked micropores. The real copper stacked micropores provided by ipcb support the wiring solution of micro BGA.
