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1 Introduction
The rapid development of the modern communications industry has ushered in an unprecedented large market for the manufacture of high-frequency copper clad laminates. As one of the basic materials for the manufacture of high-frequency copper clad laminates, the bonding sheet material, its material composition and related performance indicators, determine the realization and processability of the final product performance indicators of its design.
In view of the increasing design and application of high-frequency PTFE dielectric copper clad laminates, especially in recent years, the increasing demand for the design of PTFE dielectric high-frequency multilayer boards has brought to the majority of printed board manufacturers Unprecedented opportunities and challenges. At the same time, higher performance index requirements are put forward for the manufacture of high-frequency copper clad laminates of basic raw materials.
As we all know, for PTFE high-frequency substrate materials, the performance indicators and processability of the bonding sheet material determine the application field of high-frequency copper clad laminates. In addition, the multi-layer manufacturing technology of high-frequency printed boards, after focusing on the characteristic impedance control technology in the manufacturing technology of high-frequency multi-layer printed boards, choose which bonding sheet material system to realize the multi-layer of high-frequency boards. Chemical manufacturing has become a thorny problem that every designer and craftsman must face.
2. Current status of bonding sheet materials
Throughout the history of the development of the high-frequency copper clad laminate industry, the development of bonding sheet materials is to meet the performance of copper clad laminates.
Under the requirements of indicators, it gradually entered a new era.
From the resin system selected for the bonding sheet material, there are a total of two bonding sheet modes. One is the thermoplastic resin system bonding sheet material; the second is the thermosetting resin bonding sheet material.
2.1 Thermoplastic film bonding material
For the market demand of high-frequency copper clad laminates, twenty years ago, it was in the manufacturing stage of single- and double-sided high-frequency boards. With the rapid development of modern communication technology, more and more high-frequency copper clad laminate materials are facing the development trend of multi-layer technology in design and processing, and the importance of bonding sheet materials has become prominent.
Recalling the whole process of the production and development of high-frequency multilayer boards, thermoplastic film bonding materials will be a good choice in terms of design and selection or processing of RF multilayer boards.
Usually, in the layout process, the films are placed crosswise to achieve multi-layered clamping. Among them, it is often not known to people but needs to be concerned that the selected thermoplastic film bonding material must meet the heating process in the lamination process. In other words, the melting point of this kind of thermoplastic film adhesive material needs to be lower than the melting point of the high-frequency copper clad laminate dielectric board-polytetrafluoroethylene resin at 327°C (6200F).
As the lamination temperature rises and exceeds the melting point of the thermoplastic film, the adhesive film begins to flow. With the help of the uniform pressure applied by the laminating equipment to the clamping plate, it is filled into the copper layer circuit on the surface of the layer to be bonded. between.
