PCB News - High frequency circuit board surface treatment process

PCB surface treatment process covers: anti-oxidation, spray tin, lead-free spray tin, immersion gold, immersion tin, immersion silver, hard gold plating, full plate gold plating, gold finger head, nickel palladium gold OSP and so on.
The gold and gold plating in the process are the processes often used in PCB circuit boards. Many engineers have no way to accurately distinguish the difference between the two, so today we will summarize and summarize the differences between the two.

Is the scorpion gold-plated?

We call the whole plate gold-plated, generally refers to "electroplating gold", "electroplated nickel gold plate", "electrolytic gold", "electric gold", "electric nickel plate", there is a difference between soft gold and hard gold (ordinary hard gold is used for Gold finger head).

The principle is to melt nickel and gold (commonly known as gold salt) into chemical syrup, immersing the circuit board in the plating tank and turning on the current to form a nickel-gold plating on the copper foil surface of the circuit board.

Electro-nickel gold is widely used in electronic products due to its high hardness, wear resistance and difficulty in oxygenation.

The scorpion is Shenjin? Shenjin is a layer of coating formed by chemical oxygenation to restore the reaction. The common thickness is thicker. It is a kind of chemical nickel gold gold layer deposition method, which can reach a thick gold layer.

Difference between gold plate and gold plate

1. Ordinary immersion gold is much thicker than gold plating, and Shen Jin will be golden yellow and more yellow than gold plating. Seeing the appearance of customers is more satisfied with Shen Jin. The crystal structure formed by the two is different.

2. Because of the different crystal structure formed by immersion gold and gold plating, immersion gold is easier to weld than gold plating, which will not cause bad soldering and provoke customer complaints. At the same time, because the gold is softer than gold plating, the gold finger head plate is usually plated with gold, hard and wear resistant.

3. The immersion gold plate only has nickel gold on the pad, and the signal transmission in the skin effect is that the copper layer does not affect the signal.

4. Compared with gold plating, the gold crystal structure is finer and more precise, and it is not easy to produce oxygen.

5. As the wiring becomes denser, the line width and spacing have reached 3-4 MIL. Gold plating is prone to a short circuit of gold wire. The gold plate has only nickel gold on the pad, so it will not produce a gold wire short circuit.

6. The immersion gold plate only has nickel gold on the pad, so the solder joint on the line is more firmly bonded to the copper layer. The project does not affect the spacing when it is repaid.

7. It is generally used for relatively high-precision wrenches. The flatness is better. Normally, it is considered appropriate to use immersion gold. The immersion gold will not reveal the black pad after assembly. The flatness of the Shenjin plate is as good as the gold plate for the life to be used.

8. Today, the price of gold in the market is extremely expensive. In order to save costs, many producers are reluctant to produce gold-plated plates, and only the gold-plated plates with nickel-gold on the pads are indeed much cheaper.

Others claim that 1. Shenjin board and gold sheet are the same kind of craft products. Electric gold plate and flash gold plate are also the same kind of craft products. In fact, it is just a different kind of people in the PCB industry. It is more common in the mainland with the electric gold plate, and the gold plate and the flash gold plate are more common in Taiwan.

2. The immersion gold plate/gold plate is generally called the chemical nickel plate or the nickel plated gold plate. The growth of the nickel/gold layer is considered to be suitable and plated in the form of chemical deposition.

3. Gold-plated gold plate/flash gold plate is generally more officially called electroplated nickel gold plate or flash gold plate. The growth of nickel/gold layer is considered to be suitable and plated by DC plating.

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