PCB News - What are the requirements for PCB stackup design?

What are the requirements for PCB stackup design?

The number of layers of a multi-layer PCB, the order of stacking between layers, and the choice of board are determined by the PCB designer. This is the "PCB stacking design". So, what are the design requirements for PCB stackup?

1. Hardware cost: The hardware cost of the number of PCB layers is directly related. The more layers, the higher the hardware cost. Hardware PCBs represented by consumer products generally have the highest limit on the number of layers.

2. Outgoing lines of high-density components: For high-density components represented by BGA packaged devices, the number of outgoing layers basically determines the number of wiring layers on the PCB board.

3. Signal quality control: For PCB design where high-speed signals are more concentrated, if you pay attention to signal quality, then it is required to reduce adjacent layer wiring to reduce crosstalk between signals. At this time, the ratio of the number of wiring layers to the number of reference layers is best 1:1, it will cause an increase in the number of PCB design layers; on the contrary, if the signal quality control is not mandatory, you can use adjacent wiring layers to reduce the number of PCB layers.

4. Schematic signal definition: determine whether the PCB wiring is "smooth". Poor signal definition of the schematic will lead to irregular PCB wiring and increase the number of wiring layers.

5. PCB manufacturer's processing capability baseline: PCB designers must fully consider the PCB manufacturer's processing capability baseline, such as: processing flow, processing equipment capabilities, and commonly used PCB board types, etc.

The above is the PCB stack design requirements, I hope it will help you.

iPCB is a high-tech manufacturing enterprise focusing on the development and production of high-precision PCBs. iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. Mainly focus on microwave high frequency PCB, high frequency mixed pressure, ultra-high multi-layer IC testing, from 1+ to 6+ HDI, Anylayer HDI, IC Substrate, IC test board, rigid flexible PCB, ordinary multi-layer FR4 PCB, etc. Products are widely used in industry 4.0, communications, industrial control, digital, power, computers, automobiles, medical, aerospace, instrumentation, Internet of Things and other fields.