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Doosan DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications, Flip chip BoC & RF module
Glass Epoxy Laminates, which are widely used in industrial equipment, have been further refined and are helping to promote sustainable economic growth in an environmentally-friendly way in accordance with ongoing changes in our life style, and are the basis on which numerous environmentally-friendly products including mobile applications, computer systems, and car electronics have been developed and produced.
DS-7409
DS-7409S (N)
| Property | Unit | Test Condition | Typical Value | Test Method |
|---|---|---|---|---|
| Tg | degree Celsius | DSC | 170 | IPC-TM-650.2.4.25c |
| TMA | 165 | IPC-TM-650.2.4.24c | ||
| CTE Z-axis | ppm/ degree Celsius | Ambient to Tg | 41 | IPC-TM-650.2.4.41 |
| Z-axis expansion | % | 50 degree Celsius to 260 degree Celsius | 3.3 | IPC-TM-650.2.4.41 |
| Decomposition temperature(5% wt loss) | degree Celsius | TGA | 295 | IPC-TM-650.2.4.40 |
| T-260 | min | TMA | 7 | IPC-TM-650.2.4.24.1 |
| T-288 | min | TMA | - | IPC-TM-650.2.4.24.1 |
| Dielectric constant(Resin content 50%) | C-24/23/50(1GHz) | 4.2 | IPC-TM-650.2.5.5.9 | |
| Dissipation factor(Resin content 50%) | C-24/23/50(1GHz) | 0.015 | IPC-TM-650.2.5.5.9 | |
| Peel strength(Standard profile 1oz) | N/mm | Condition A | 2.0 | IPC-TM-650.2.4.8 |
| Water absorption | % | E-24/50+D-24/23 | 0.12 | IPC-TM-650.2.6.2.1 |
