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What materials are used for Rogers' high-frequency board production/circuit board?
The main material used in printed circuit boards is copper-plated plates, which can also be called basic materials. This is a short book of Shenzhen printed circuit manufacturer to share with you: basic knowledge about the application, structure and characteristics of coated copper plates.
Copper coated sheets are also called basic materials.
Copper laminate (CL) is a cellulose paper or glass fiber product that is impregnated with resin, coated and heated with copper foil on one or both sides. When using a multi-layer card, it is also called the "main map".
What is the material of the circuit board?
At present, the market supply of copper coatings can be divided into the following categories: paper substrates, glass fiber substrates, synthetic fiber substrates, non-woven fabric substrates and composite substrates.
The substrate is an insulating layer, the insulating layer is a macromolecular synthetic resin and a reinforcing material; a pure copper foil with high conductivity and solderability, suitable for the surface of the substrate, the thickness is usually 35 Up to 50/horse; a coated copper-coated flake.
A part of the substrate is called a single-sided copper-coated sheet; the copper-coated sheet coated on both sides of the substrate is called a double-sided copper-plated sheet; if the copper foil can be firmly coated on the liner On the bottom, the copper foil is connected. The thickness of the copper-containing laminate is 1.0 mm, 1.5 mm, and 2.0 mm.
There are several common copper laminated laminates.
(Name) Phenol cotton paper cotton candy paper cotton and epoxy resin and epoxy resin epoxy resin, epoxy resin EF-FR-5 and epoxy resin polyester glass G-10 glass and epoxy resin CEM-1-cotton paper, Epoxy resin (flame retardant) CEM-2-cotton paper, epoxy resin (without flame retardant)
CEM-3 type of glass and epoxy resin CEM-4-Glass Cloth and Epoxy Resin CEM-5 AN-aluminum nitride SiC SIC of polyester glass There are several copper-coated laminates.
According to different insulating materials, it can be divided into paper substrate, glass substrate and synthetic fiberboard; according to different adhesive resins, it can be divided into phenol, epoxy, polyester and polytetrafluoroethylene; according to use, it can be divided into For the general type and speculation.
The structure and characteristics of copper laminate materials commonly used in China
(1) Copper foil laminate is a laminated product, thermal spray resin impregnated paper (1TT-63) made of insulating paper (TFZ-62) or cotton fiber impregnated paper (1TTT-63). Double-sided adhesive paper can be fixed by an impregnated non-stick glass adhesive tissue, one of which is covered with a sheet of copper foil. Mainly used for radio equipment on printed circuit boards.
(2) Copper-coated phenolic resin glass laminate is a laminate product, the laminate is a laminate material, the laminate is an alkali-free glass fiber fabric impregnated with hot-pressed ring epoxy resin Made. Copper foil is applied on one or both sides of the laminate, and its advantages are: purity, good electrical and mechanical properties and practical handling. The surface of the plate is bright. If the amine is used as a curing agent, the surface of the plate is clear and has good transparency. The invention is mainly used for high temperature and high operating frequency in printed circuit boards.
(3) The copper-plated copper laminate is a copper-plated layer, and the copper foil is made of copper laminate and copper foil. This system is mainly used for printed circuits in high frequency and ultra high frequency lines.
(4) Copper-coated epoxy glass fabric laminate is a common material for porous metal polychlorinated biphenyls.
(5) A copper film containing soft polyester is a strip material made of polyester and copper film obtained by hot pressing. During application, it is spiral-shaped, inside the device. In order to strengthen or prevent humidity, epoxy resin is often used as a whole. It is mainly used for flexible printed circuit boards and printed cables, and can be used as a transition line for connectors. It should be pointed out that before the copper coating, the corresponding batching wiring must first be assembled and unloaded: 5.0, 3, 3, etc., so that a variety of polycrystalline structures of different shapes can be formed.
