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Nowadays, the use of high-frequency PCB multi-layer circuit boards on the market has become a popular trend, and in the development of the industry, the ability of many PCB manufacturers to develop and produce PCB multi-layer circuit boards has become more prominent. So, what are the requirements for the proofing of PCB multilayer circuit boards?
1. Requirements for neat appearance. When the PCB multilayer circuit board is proofed, the appearance of the sample board should be smooth, no burrs appear at the corners, and no blistering and delamination between the wire and the solder mask. Only in this way, the PCB multilayer circuit board can guarantee a better welding effect, and at the same time ensure that the PCB multilayer circuit board produced by the PCB manufacturer meets the appearance requirements of actual use.
2. Requirements of reasonable craftsmanship. PCB multi-layer circuit boards also need to study whether its process is reasonable before proofing, such as whether there is a problem of mutual interference between circuits, etc., to ensure long-term stable operation of high-frequency microwave circuit boards and PCB multi-layer circuit boards.
3. Requirements for CAM optimization. To obtain high-quality PCB multi-layer circuit boards, relevant CAM processing is required during proofing. This processing includes adjusting the line width, and optimizing the spacing and pads, etc., to ensure that the circuit interaction between the PCB multi-layer circuit boards has a good signal, and the quality of the sample board is more superior.
The above are the basic requirements for high-speed PCB multi-layer circuit board proofing. High-quality proofing can make high-frequency PCB multi-layer circuit boards have higher quality, and mass production can be carried out after ensuring the quality. Therefore, PCB multi-layer circuit boards are as required Reasonable design planning is also for the better production of high-frequency PCB multilayer circuit boards.
