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PTFE ceramic composite dielectric substrate TFA series of products of the dielectric layer composition of PTFE resin and ceramic, do not use the glass fiber cloth dipping method to make prefabricated sheet, but the use of new technology to make prefabricated sheet, and then pressed by a special pressing process. With the same level of dielectric constant excellent electrical properties, thermal properties, mechanical properties, is aerospace grade high frequency high reliability materials, can replace similar foreign products.
TFA series of substrate does not contain glass fiber cloth, using a large number of uniform special nano-ceramics and resin mixture, electromagnetic wave propagation without glass fiber effect, excellent frequency stability, dielectric loss of the same level of the lowest, the material X / Y / Z the lowest anisotropy, the material at the same time has the same as the copper foil low thermal expansion coefficient, stable dielectric temperature characteristics.
The dielectric constant of this series is 2.94, 3.0, 6.15, 10.2. The TFA series comes standard with RTF low roughness copper foil, which reduces conductor loss while providing excellent peel strength.
TFA294 and TFA300 can be matched with buried 50Ω resistive copper foil to form resistive film sheets. The circuit board can be processed by standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; at the same time, it shows excellent processability in the processing of dense holes and fine lines.
PTFE Ceramic Composite Dielectric Substrate TFA Series
TFA Series Product Features
Small dielectric constant tolerance and excellent batch-to-batch consistency;
lowest dielectric loss in its class;
Use of frequencies up to 77G for millimeter wave and automotive radar applications;
Excellent frequency stability and phase stability from -55°C to 150°C;
Excellent irradiation resistance, maintaining stable dielectric and physical properties after dose irradiation treatment;
low outgassing performance, tested according to the standard method of material volatility performance under vacuum conditions, meeting the requirements of vacuum outgassing for aerospace applications;
Excellent thermal expansion coefficient, equal to copper foil; ensures the reliability and dimensional thermal stability of copper hole;
Low water absorption, ensuring the stability of the material under humid environment.
TFA Series Typical Applications
Aerospace equipment, space, in-cabin equipment, aircraft
Microwave, antenna, phase-sensitive antenna
Early warning radar, airborne radar and other kinds of radar
Phased array antennas, beamwave networks
Satellite communication, navigation
Power amplifier
