PCB Technical - The impact of IPD on the development of PCB technology

With the development of electronic technology, the integration of active electronic components has greatly increased after semiconductors have moved from micron process to nano-fabrication, and the demand for passive components with active components has increased significantly. Market development of electronic PCB products The trend is lighter, thinner, shorter and smaller. Therefore, the improvement of semiconductor process capabilities has greatly increased the number of active components in the same volume. In addition to the substantial increase in the number of supporting passive components, more space is also required to place these passive components, so it will inevitably increase The size of the overall packaged device is very different from the development trend of the market. From the perspective of cost, the total cost is directly proportional to the number of passive components. Therefore, under the premise of using a large number of passive components, how to reduce the cost of passive components Cost and space, and even improving the performance of passive components, are currently one of the most important issues.

With the advancement of technology, PCB printed circuit boards are developing in the direction of higher precision and higher density, and are gradually highly integrated with the field of IC packaging. The integration of passive components is in line with the development trend of today's electronic systems. IPD technology has become a system. An important implementation of SiP.

IPD integrated passive component technology has high wiring density, small size, light weight; high integration, can be embedded resistance, inductance, capacitor and other passive components and active chips; good high-frequency characteristics, can be used in microwave and millimeter wave fields And other advantages. The thin-film IPD integrated passive component technology is applied to PCB processing to save packaging area, improve signal transmission performance, reduce costs, and improve reliability. Through the integrated advantages of IPD technology, bridge the gap between packaging technology and PCB technology. The widening gap between the two can effectively reduce the volume and weight of the complete electronic machine and system, and has a broad market prospect.

PCB processing is applied to IPD integrated passive components, and high thermal conductivity metals, diamonds, ceramics or aluminum-silicon carbide composite materials can be used as substrates to manufacture high-density and high-power multilayer circuit substrates. At the same time, IPD passive integrated PCB substrates should be strengthened The process improvement. The improvement of material characteristics and lower cost, as well as speeding up the application in the fields of microwave communication, high-density integration and high-power.

6 Conclusion

Thin-film IPD integrated passive component technology can integrate a variety of electronic functions, has the advantages of miniaturization and improved system performance, and can replace bulky discrete passive components. At the same time, PCB processing can introduce IPD technology, through the integration advantages of IPD technology, Can bridge the widening gap between packaging technology and PCB technology.

The rapid development of thin-film IPD integrated passive component technology has enabled passive integration technology to enter the stage of practicality and industrialization. The new generation of passive components and related integration technologies will be widely used in aerospace, military, medical, industrial control and The electronic industry in various fields such as communications, therefore, the development of IPD technology is of great significance to the development of the PCB company itself and the enhancement of the competitiveness of the domestic industry.