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For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. The reliability of the electronic equipment Performance will decrease.
Therefore, it is very important to conduct a good heat dissipation treatment on the circuit board. The heat dissipation of the PCB circuit board is a very important link, so what is the heat dissipation technique of the PCB circuit board, let's discuss it together below.
01 Heat dissipation through the PCB itself The currently widely used PCB boards are copper clad/epoxy glass cloth substrates or phenolic resin glass cloth substrates, as well as a small amount of paper-based copper clad boards.
Although these substrates have excellent electrical properties and processing properties, they have poor heat dissipation. As a heat dissipation path for high-heating components, it is almost impossible to expect heat from the resin of the PCB itself to conduct heat, but to dissipate heat from the surface of the component to the surrounding air.
However, as electronic products have entered the era of miniaturization of components, high-density mounting, and high-heating assembly, it is not enough to rely on the surface of a component with a very small surface area to dissipate heat.
At the same time, due to the extensive use of surface mount components such as QFP and BGA, a large amount of heat generated by the components is transferred to the PCB board. Therefore, the best way to solve the problem of heat dissipation is to improve the heat dissipation capacity of the PCB itself, which is in direct contact with the heating element, through the PCB board. Conducted or radiated.
▼Add heat dissipation copper foil and copper foil with large area power supply
▼Heat via
▼Copper is exposed on the back of the IC to reduce the thermal resistance between the copper skin and the air
PCB layout
Thermal sensitive devices are placed in the cold wind area.
The temperature detection device is placed in the hottest position.
The devices on the same printed board should be arranged as far as possible according to their calorific value and degree of heat dissipation. Devices with low calorific value or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed in the cooling airflow. The uppermost flow (at the entrance), the devices with large heat or heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed at the most downstream of the cooling airflow.
In the horizontal direction, the high-power devices are arranged as close to the edge of the printed board as possible to shorten the heat transfer path; in the vertical direction, the high-power devices are arranged as close as possible to the top of the printed board to reduce the influence of these devices on the temperature of other devices. .
The heat dissipation of the printed board in the equipment mainly relies on air flow, so the air flow path should be studied during the design, and the device or printed circuit board should be reasonably configured.
When air flows, it always tends to flow in places with low resistance, so when configuring devices on a printed circuit board, avoid leaving a large airspace in a certain area. The configuration of multiple printed circuit boards in the whole machine should also pay attention to the same problem.
The temperature-sensitive device is best placed in the lowest temperature area (such as the bottom of the device). Never place it directly above the heating device. It is best to stagger multiple devices on the horizontal plane.
Place the devices with the highest power consumption and heat generation near the best position for heat dissipation. Do not place high-heating devices on the corners and peripheral edges of the printed board, unless a heat sink is arranged near it.
When designing the power resistor, choose a larger device as much as possible, and make it have enough space for heat dissipation when adjusting the layout of the printed board.
Recommended component spacing:
02 High heat-generating components plus radiators and heat-conducting plates. When there are a few components in the PCB that generate large amounts of heat (less than 3), you can add a radiator or heat pipe to the heat-generating components. When the temperature cannot be lowered, A radiator with a fan is used to enhance the heat dissipation effect.
When the number of heating devices is large (more than 3), a large heat dissipation cover (board) can be used, which is a special heat sink customized according to the position and height of the heating device on the PCB or a large flat heat sink Cut out different component height positions. The heat dissipation cover is integrally buckled on the surface of the component, and it is in contact with each component to dissipate heat.
However, the heat dissipation effect is not good due to the poor consistency of height during assembly and welding of components. Usually, a soft thermal phase change thermal pad is added on the surface of the component to improve the heat dissipation effect.
03 For equipment that adopts free convection air cooling, it is best to arrange integrated circuits (or other devices) in a vertical or horizontal manner.
04 Adopt a reasonable wiring design to achieve heat dissipation. Because the resin in the plate has poor thermal conductivity, and the copper foil lines and holes are good heat conductors, increasing the remaining rate of copper foil and increasing the heat conduction holes are the main means of heat dissipation. To evaluate the heat dissipation capacity of the PCB, it is necessary to calculate the equivalent thermal conductivity (nine eq) of the composite material composed of various materials with different thermal conductivity-the insulating substrate for the PCB.
05 The devices on the same printed board should be arranged as far as possible according to their calorific value and degree of heat dissipation. Devices with low calorific value or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed in cooling The uppermost flow (at the entrance) of the airflow, and the devices with large heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed at the most downstream of the cooling airflow.
06 In the horizontal direction, high-power devices are placed as close to the edge of the printed board as possible to shorten the heat transfer path; in the vertical direction, high-power devices are placed as close as possible to the top of the printed board to reduce the temperature of other devices when these devices are working. Influence.
07 The heat dissipation of the printed board in the equipment mainly relies on air flow, so the air flow path should be studied during the design, and the device or printed circuit board should be reasonably configured.
When air flows, it always tends to flow in places with low resistance, so when configuring devices on a printed circuit board, avoid leaving a large airspace in a certain area.
The configuration of multiple PCBs in the whole machine should also pay attention to the same problem.
08 The temperature-sensitive device is best placed in the lowest temperature area (such as the bottom of the device). Never place it directly above the heating device. It is best to stagger multiple devices on the horizontal plane.
09 Place the components with the highest power consumption and heat generation near the best position for heat dissipation. Do not place high-heating devices on the corners and peripheral edges of the printed board, unless a heat sink is arranged near it. When designing the power resistor, choose a larger device as much as possible, and make it have enough space for heat dissipation when adjusting the layout of the printed board.
10 Avoid the concentration of hot spots on the PCB, distribute the power evenly on the PCB board as much as possible, and keep the PCB surface temperature performance uniform and consistent.
It is often difficult to achieve strict uniform distribution during the design process, but areas with too high power density must be avoided to prevent hot spots from affecting the normal operation of the entire circuit.
If possible, it is necessary to analyze the thermal efficiency of the printed circuit. For example, the thermal efficiency index analysis software module added in some professional PCB design software can help designers optimize the circuit design.
