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Folding mobile phones have been regarded as an industry direction. This year, manufacturers such as Huawei, Huawei, Samsung, and Rouyu have officially released folding screen mobile phones, and manufacturers such as Xiaomi, OPPO, and vivo have also come up with relevant prototypes of folding screen mobile phones. The first year of folding mobile phones has been opened. Among them, the flexible circuit board has become an indispensable component of a folding mobile phone due to its light weight, thin thickness, and good bendability. The FPC (flexible circuit board) application in smart phones still faces many technical difficulties, which will become the focus of current manufacturers to overcome.
FPC has the characteristics of light and thin, bendable, winding, foldable, and high wiring density, which perfectly fits the development theme of lightness,
thinness and miniaturization. In recent years, it has become the leader of the PCB (printed circuit board) sub-industry. Some experts said that it is not difficult to realize flexible screens in FPC at present, mainly in the display screen and PCB rigid board. To achieve a foldable PCB, a long research and development process is required, and there is also a great deal of electronic materials. The challenge.
FPC flexible circuit board
FPC is mainly used in mobile terminals, consumer electronics, automotive electronics, industrial control, medical, aerospace and military, etc. Among them, the mobile terminal category is the largest application field of FPC, especially the smart phone, which is also the field with the highest technical requirements for FPC, and will also lead the technical development direction of FPC in the future. The development trend of miniaturization and intelligence will promote flexible mobile phones to become a trend in the future.
Experts also put forward solutions to the requirements of FPC for folding, connecting and using folding screens multiple times. In a flexible screen mobile phone, since it needs to be folded multiple times and used in a large amount, the requirements for the flexible circuit board inside the mobile phone will be higher, and the corresponding use area will be further increased. However, FPC is usually manufactured by batch method, so it is limited by the size of production equipment. In response to this problem, experts believe that it can be extended through the middle socket, and the FPC can be reinforced by plugging and inserting the golden finger.
At present, for the connection of soft and hard boards, the main process and technology is to make rigid and flexible boards. With regard to size issues, the current soft boards or rigid and flexible boards in the industry use 250mm wide materials, and they are also beginning to try to use them. Material with a width of 500MM.
The increase of FPC applications in mobile phones will become an established trend, which also makes the FPC market present a positive trend. However, FPC still faces manufacturing problems, such as large-size applications in folding screen mobile phones. Of course, there are corresponding solutions to these problems, but these solutions inevitably bring about an increase in cost. How to better control the cost of FPC can only be solved by mass production or technological upgrading.
