PCB Technical - FPC process, performance indicators and test methods

The process of FPC soft board includes exposure, PI etching, opening, electrical testing, punching, appearance inspection, performance testing and so on. The production process of the FPC soft board is related to the performance of the FPC. After the production is completed, it needs to be tested to screen out the unqualified FPC...

The process of FPC soft board includes exposure, PI etching, opening, electrical testing, punching, appearance inspection, performance testing and so on. The production process of the FPC soft board is related to the performance of the FPC. After the production is completed, it needs to be tested to screen out the unqualified FPC soft board to ensure that the FPC maintains good performance in the application and plays the best role. In the FPC soft board test, a high-current shrapnel micro-needle module with conduction and connection functions can be used to ensure the stability and efficiency of the FPC soft board test.

In the FPC soft board process, the exposure is to transfer the circuit pattern to the board through the function of the dry film. It is usually carried out by the photosensitive method. After the exposure is completed, the circuit of the FPC soft board is basically formed. The dry film can transfer the image, but also Protect the circuit during the etching process.

PI etching means that under certain temperature conditions, the etching solution is evenly sprayed on the surface of the copper foil through the nozzle, and the oxidation-reduction reaction occurs with the copper, and then the circuit is formed after the film removal treatment. The purpose of the opening is to form the original conductor line and the interconnection line between the layers. The opening process is often used for the conduction connection of the upper and lower layers of the double-layer FPC.

In addition to the service life, reliability performance and environmental performance of the FPC soft board, the performance test of FPC also includes folding resistance, flex resistance, heat resistance, solvent resistance, solderability, peeling performance, etc. .

The folding resistance and flex resistance of the FPC soft board are related to the material and thickness of the copper foil, the type and thickness of the glue used for the base material, and the material and thickness of the insulating base material. In the FPC soft board assembly process, the double-layer and multilayer FPC copper foils have good symmetry when they are pressed together, so the bending resistance and bending resistance will be better.

FPC soft board performance test requires professional equipment. Among them, the high-current shrapnel microneedle module has a stable conduction effect. Its integrated shrapnel-type design has the characteristics of high overall accuracy and good electrical conductivity. During transmission, it can carry current in the range of 1-50A, the current flows in the same material body, the voltage is constant, the current has no attenuation, and the performance is stable and reliable; in a small pitch, it can cope with the pitch value between 0.15mm-0.4mm, and Maintain a stable connection, do not keep the pin stuck, the performance and service life are very superior. After the shrapnel is gold-plated and hardened, the average service life can reach more than 20w times, which can greatly improve the test efficiency of the FPC soft board, and it does not need to be replaced frequently in high-frequency tests, so material waste and unnecessary losses can be avoided.

For FPC soft board testing, both in terms of performance and cost performance, high-current shrapnel microneedle modules are a very reliable choice, with irreplaceable advantages, which can guarantee the stability of the test and have a long service life. It can improve the testing efficiency of FPC soft board and ensure the quality of FPC soft board.