PCB Technical - FPC automatic placement machine to mount bulk materials

FPC circuit board machine mounting bulk material processing method and the cause of the fault of the mounting machine flying parts

One: FPC circuit board automatic placement machine placement bulk material processing method

When the automatic placement machine is officially running, a lot of bulk materials are generated due to various reasons. The thrown materials are either bulk materials or other reasons. Some bulk materials are not easy to distinguish if they are resistors, capacitors, inductances, etc. And its own value is small, there is no value for reuse, and it can be treated as waste. However, for large components, especially imported chip components, they are of high value and can be distinguished and distinguished. Therefore, they are usually re-used and mounted on the circuit board. Below, Fushunchang placement machine will share how the automatic placement machine handles the placement of bulk ICs.

1. If you use tray packaging on the automatic placement machine or have a suitable tray, the problems may be solved better. Otherwise, it may be more difficult to deal with. Generally, if the material drop is relatively small, the operator can fill the feed belt in time, but the next best thing is not to fill too much and need to pay attention to the direction.

2. The bulk material processing method of the automatic placement machine: collect the used braid of a fixed length, find a thinner flat plate, and use double-sided tape to glue the appropriate length of the braid to the flat plate. Note: Try to ensure that the position of the trough is aligned. Refill the bulk material into the tape.

3. Prepare a program using Tray disk on the automatic placement machine, input the self-made Tray information into the program, call the new program, and make it OK. Develop a dumping control table. If there are more bulk materials, you can collect some tapes and braids that are suitable for bulk packaging specifications, and then put the bulk materials into the tape and seal the braid with double-sided tape. You can refer to the original packaging when unloading.

4. IC bulk materials should be mounted on the circuit board with a placement machine as much as possible, but if it is really impossible to use an automatic placement machine to mount on the circuit board, manual placement and production can be carried out.

Two: FPC circuit board high-speed placement machine flying parts failure reasons

The key equipment in SMT production-the placement machine has also been developed accordingly, but during the use of the placement machine, some failures will inevitably occur. There are many failures of flying parts in high-speed placement machines. Flying parts refer to the loss of components in the placement position. The main reasons for this are as follows:

1. The component thickness is set incorrectly. If the component thickness is thin, but the database is set thicker, then the nozzle will be put down when the component has not reached the pad position during placement, and the xy workbench of the PCB will be fixed It is moving at high speed again, which leads to flying parts due to inertia. Therefore, the component thickness must be set correctly.

2. The FPC thickness is set incorrectly. If the actual thickness of the FPC is thinner but the database is thicker, the support pin will not be able to fully lift the FPC during the production process, and the component may be put down before it reaches the pad position. This leads to flying parts.

Three, the reasons of FPC, usually there are several reasons like this:

1. The problem of FPC itself, the warpage of FPC exceeds the allowable error of the equipment.

2. The support pin placement problem. When doing double-sided mounting PCB, when doing the second side, the support pin is on the bottom component of the FPC, causing the FPC to warp upwards, or the support pins are not placed evenly, and some parts of the FPC are not topped, which makes the FPC incomplete Was jacked up.