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PCB Technical

PCB Technical - Heat dissipation skills of PCB board

PCB Technical

PCB Technical - Heat dissipation skills of PCB board

Heat dissipation skills of PCB board

2021-10-18
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Author:Frank

The heat generated when the electronic equipment is working makes the internal temperature of the equipment rise rapidly. If the heat is not dissipated in time, the equipment will continue to rise, and the device will fail due to overheating, and the reliability of the electronic equipment will decline. Therefore, it is very important to heat the printed circuit board.

1. Printed circuit board temperature rise factor analysis

The direct cause of temperature rise of PCB is the existence of circuit power devices, electronic devices have varying degrees of power consumption, heating intensity varies with the power consumption.

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2. Phenomena of temperature rise in printed circuit board:

(1) local or large area temperature rise;

(2) Short-term temperature rise or long-term temperature rise.

In the analysis of PCB thermal power, it is generally analyzed from the following aspects.

Electrical power consumption

(1) Analysis of power consumption per unit area;

(2) Analyze the distribution of power consumption on PCB board.

Structure of printed board

(1) Printed board size;

(2) Printed board materials.

3. Installation method of printed board

(1) installation method (such as vertical installation, horizontal installation);

(2) the sealing condition and the distance from the shell.

4. Thermal radiation

(1) radiation coefficient of printed board surface;

(2) The temperature difference between the printed board and adjacent surfaces and their absolute temperature;

5. heat conduction

(1) install the radiator;

(2) Conduction of other installed structural parts.

6. heat convection

(1) natural convection;

(2) Forced cooling convection.

The analysis of the above factors from PCB board is an effective way to solve the temperature rise of printed board, often in a product and system these factors are interrelated and dependent, most of the factors should be analyzed according to the actual situation, only for a specific actual situation can correctly calculate or estimate the temperature rise and power consumption and other parameters.