PCB Technical - Cause analysis and prevention of PCBA assembly explosion-proof measures

Cause analysis and prevention of PCBA assembly explosion-proof measures

The key to solving the problem is to reduce the moisture absorption of the printed board during the manufacturing, storage and use of the printed board. To this end, there are the following measures:

1. PCB packaging and storage
After the circuit board manufacturer has completed the production of the high CTI value PCB, the baking process is carried out to bake and dehumidify, and then the high vacuum double film packaging is used twice to increase the sealing of the printed board packaging, and finally a desiccant is placed in the large package .
The packaged PCB should be stored in an environment with normal temperature and low humidity, and placed in the original packaging on the platform or on a suitable shelf. Avoid heavy pressure and prevent plate deformation caused by improper storage. The storage period is 3 months.
PCBA assembly manufacturers should check whether the packaging is intact for this kind of PCB materials, confirm the effective storage period, and whether the status of the humidity card in the inner packaging meets the requirements. Prevent the use of overdue PCB.

2. PCBA board production
First, perform the baking process of the PCB light board for dehumidification before mounting, and then put it into production to complete the mounting-inserting-testing-packaging and shipping. The entire production process is required to be completed within a week in the production plan.
Set the temperature curve for reflow soldering and wave soldering according to their operating instructions. The preheating rate cannot be too fast. Set the peak temperature not to exceed 245 degrees Celsius. The higher the temperature, the greater the risk of panel explosion. For repair welding of manual welding, use a temperature-controlled soldering iron, set the temperature at 350 degrees Celsius, and control the welding time at 2~3s to prevent local overheating and potential defects.

For the production of PCBA with CTI>600, the key to preventing plate explosion is to do a good job of prevention and quality monitoring. The production management of PCBs with CTI>600 should be traced back. Production management of PCB with CTI>600. They are the cornerstone to prevent the board from bursting.
In addition, the thermal stress control in PCBA assembly and production can prevent the influence of thermal stress factors caused by the board explosion, which can completely reduce or even eliminate the impact of the board explosion, and can completely reduce or even eliminate the occurrence of the board explosion.

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