PCB Technical - Rogers RO3003 Technical Specification

The RO3003 from Rogers Corporation is a Ceramic-filled PTFE based Laminate that can be used for RF & Microwave applications up to 40 GHz. The laminate has a dielectric constant of 3 (8-40 GHz) and provides exceptional plated through-hole reliability, even in severe thermal environments. It exhibits a coefficient of thermal expansion (CTE) of 17 ppm/degree C on the X and Y axis and 24 ppm/degree C on the Z-axis. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage (after etch and bake) of less than 0.5 mils per inch.

The laminate is fabricated into printed circuit boards using the standard PTFE circuit board processing techniques and is suitable for use with epoxy glass multilayer board hybrid designs. It is ideal for global positioning satellite antennas, cellular telecommunications systems, power amplifiers and antennas, patch antenna for wireless communications, direct broadcast satellites, datalink on cable systems, remote meter readers, power backplanes, and automotive radar applications.

RO4003 material can be removed with a traditional nylon brush. No special treatment is required before copper electroplating without electricity. The board must be processed using a traditional epoxy/glass process. Usually, it is not necessary to remove the drill hole, because the high TG resin system (280°C + [536°F]) is not prone to discoloration during the drilling process. If the stain is caused by aggressive drilling operations, the resin can be removed using a standard CF4/O2 plasma cycle or a dual alkaline permanganate process.

The surface of the board can be mechanically and/or chemically prepared for light protection. It is recommended to use standard aqueous or semi-aqueous photoresist. Any commercially available copper wiper can be used. All filterable or photo solder masks commonly used for epoxy/glass laminates adhere very well to the surface of RO4003. Mechanical cleaning of exposed dielectric surfaces before applying solder mask and designated "registered" surfaces should avoid optimal bonding.

HASL and REFLOW:

The cooking requirements of RO4000 material are equivalent to epoxy/glass. Generally, equipment that does not cook epoxy/glass plates does not need to cook RO4003 plates. For installing epoxy/baked glass as part of the conventional process, we recommend cooking at 300°F, 250°F (121°C-149°C) for 1 to 2 hours. RO4003 does not contain flame retardants. It is understood that a board encapsulated in an infrared (IR) unit or running at a very low transmission speed can reach temperatures in excess of 700°F (371°C). RO4003 can start to burn at these high temperatures. Systems that still use infrared reflow devices or other equipment that can reach these high temperatures should take necessary precautions to ensure that there is no risk.

Life of life:

High-frequency laminates can be stored indefinitely at room temperature (55-85°F, 13-30°C) and humidity. At room temperature, dielectric materials are inert under high humidity. However, when exposed to high humidity, metal coatings such as copper can be oxidized. PWB's standard pre-cleaning can easily remove corrosion from the correct storage materials.

ROUTE:

RO4003 material can be processed using tools and hard metal conditions normally used for epoxy/glass. The copper foil must be removed from the guide channel to prevent smearing.

Rogers Ro3003

Ro3003 is a high frequency PCB material ceramic filled PTFE composite material for commercial microwave and radio frequency applications. This series of products is designed to provide excellent electrical and mechanical stability at a competitive price. Rogers Ro3003 has excellent dielectric constant stability over the entire temperature range, including the elimination of dielectric constant changes that occur when PTFE glass materials are used at room temperature. In addition, the loss factor of the Ro3003 laminate is as low as 0.0013 to 10 GHz.

Rogers RO3003 is a ceramic-filled PTFE composite/laminate for commercial microwave and radio frequency applications. It has excellent stability, with a dielectric constant of 3 to 40 GHz at room temperature. The material has a dissipation factor (Df) of 0.0013 to 10 GHz, which is ideal for bandpass filters, microstrip antennas and voltage controlled oscillators. High-performance materials for radio frequency and microwave PCB board. Rogers RO3003 is used to generate high-frequency laminates for microwave prototypes and high-frequency PCB. The dielectric loss of these materials is very low, up to 40 GHz. We sell two sizes of 4.5 x 6 inches and 9 x 6 inches to keep the cost for audiophiles.

Rogers RO3003

Dielectric constant: 3.00

Loss factor: 0.0013

Substrate thickness: 0.02" (0.5 mm)

Copper thickness: 0.5 ounces

Small size = 4.5" x 6"

RO3000 printed circuit typical application

Automotive radar applications

GPS satellite antenna

Mobile communication system: power amplifier and antenna

Patch antenna for wireless communication

Satellite for direct transmission

Data link cable system

Remote meter reader