PCB Technical - PCB circuit board proofing process

With the rapid development of the mobile phone, computer, electronic and digital industries, the PCB circuit board industry is also constantly meeting the needs of the market and consumers, which has promoted the continuous increase of industry output value. However, the competition in the PCB circuit board industry is increasing, and many PCB manufacturers are not hesitating Reduce prices and exaggerate production capacity to attract a large number of customers. However, low-priced PCB boards must use cheap materials, which will affect the quality of the product, have a short service life, and the product is prone to surface damage, bumps and other quality problems.

The purpose of PCB circuit board proofing is to determine the strength of the manufacturer, which can effectively reduce the defective rate of PCB circuit board production, and to lay a solid foundation for future mass production. The following is an explanation of the PCB circuit board proofing process.

PCB circuit board proofing process:

One, contact the manufacturer

First of all, you need to inform the manufacturer of the documents, process requirements, and quantity, about "what parameters need to be provided to the manufacturer for PCB circuit board proofing?" Follow up the production schedule.

Second, open material

Purpose: According to the requirements of the engineering data MI, the large sheets that meet the requirements are cut into small pieces of production board, which meet the customer's requirements.

Process: large sheet - cutting board according to MI requirements - curium board - beer fillet\grinding - board out

Three, drilling

Purpose: According to the engineering data, drill the required hole diameter in the corresponding position on the sheet material that meets the required size.

process: stacked plate pin - upper plate - drilling - lower plate - inspection\repair

Four, Shen copper

Purpose: Immersion copper is to deposit a thin layer of copper on the insulating hole wall by chemical method.

Process: rough grinding - hanging board - automatic copper sinking line - lower board - dip 1% dilute H2SO4 - thickened copper

Five, graphics transfer

Purpose: Graphic transfer is to transfer the image on the production film to the board.

Process: (blue oil process): grinding plate - printing the first side - drying - printing the second side - drying - exploding - shadowing - inspection; (dry film process): hemp board - pressing film - standing - right Position-Exposure-Standing-Development-Check

VI. Graphic plating

Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and a gold-nickel or tin layer with the required thickness on the exposed copper skin of the circuit pattern or the hole wall.

process: upper board - degreasing - second water washing - micro-etching - water washing - pickling - copper plating - water washing - pickling - tin plating - water washing - lower board

七, Remove the film

Purpose: Use NaOH solution to remove the anti-plating coating film to expose the non-circuit copper layer.

Process: water film: insert rack - soak alkali - rinse - scrub - pass machine; dry film: release board - pass machine

8. Etching

Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts.

Nine, green oil

Purpose: Green oil is to transfer the graphic of the green oil film to the board to protect the circuit and prevent the tin on the circuit when welding parts.

process: grinding plate - printing photosensitive green oil - curium plate - exposure - developing; grinding plate - printing the first side - drying plate - printing the second side - drying plate

十, Character

Purpose: Characters are provided as a mark for easy identification.

Process: After the green oil finishes - cool and stand - adjust the screen - print characters - back

eleven, gold-plated fingers

1. Purpose: to plate a nickel/gold layer with the required thickness on the plug finger to make it more hard and wear-resistant.

process: upper plate - degreasing - washing twice - micro-etching - washing twice - pickling - copper plating - washing - nickel plating - washing - gold plating

2, tin plate (a process in parallel)

Purpose: spray tin is to spray a layer of lead tin on the bare copper surface that is not covered with solder mask to protect the copper surface from corrosion and oxidation, so as to ensure good soldering performance.

process: micro-etching - air drying - preheating - rosin coating - solder coating - hot air leveling - air cooling - washing and air drying

12. Forming

Purpose: Organic gongs, beer board, hand gongs, and hand-cutting methods are used to form the shapes required by customers through die stamping or CNC gongs.

Description: The accuracy of the data gong machine board and the beer board is higher. The hand gong is second, and the minimum hand-cutting board can only make some simple shapes.

13. Test

Purpose: To pass electronic 100% testing to detect defects that affect functionality, such as open circuits and short circuits that are not easy to find visually.

Process: upper mold - release board - test - pass - FQC visual inspection - unqualified - repair - return test - OK - REJ - scrap

Fourteen, final inspection

Purpose: To pass 100% visual inspection of board appearance defects, and to repair minor defects to avoid problems and defective boards from flowing out.

The specific work flow: incoming materials - check information - visual inspection - qualified - FQA spot check - qualified - packaging - unqualified - processing - inspection OK!

Because of the high technical content of PCB circuit board design, processing and manufacturing. Therefore, only by accurately and rigorously doing a good job in every detail of PCB proofing and production, can we have high-quality PCB products. Win the favor of more customers and win a bigger market.