PCB Technical - What is the difference between PCB soldering layer and solder mask?

What is the difference between PCB soldering layer and solder mask?
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields.
1. Different definitions
1. Solder mask-solder mask refers to the part of the printed circuit board to be painted with green oil. In fact, this solder mask uses a negative output, so after the shape of the solder mask is mapped to the board, the solder mask is not painted with green oil, but the copper skin is exposed.

2. The soldering layer is actually a steel mesh-paste mask, which is used for machine placement. Its main function is to help the deposition of solder paste; the purpose is to transfer an accurate amount of solder paste to an accurate position on the empty PCB.

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Two, the function is different

1. The solder mask is to open the window on the whole piece of solder mask green oil, the purpose is to allow welding, by default, the area without solder mask must be green oil;

2. The soldering layer is used to make steel mesh for the steel mesh factory, and the steel mesh can accurately put the solder paste on the patch pads that need to be soldered when tinning. It is used for patching. Package

Three, different craftsmanship

1. Solder mask production: solder mask materials must be used through liquid wet process or dry film lamination.

Dry film solder mask materials are supplied in a thickness of 0.07-0.1mm (0.03-0.04″), which can be suitable for some surface mount products, but this material is not recommended for close-pitch applications. Generally, the solder mask opening should be larger than The pad is 0.15mm (0.006") larger. This allows a gap of 0.07mm (0.003") on all sides of the pad.

Low-profile liquid photosensitive solder mask materials are economical and are usually specified for surface mount applications, providing precise feature sizes and gaps.

2. The process of making the soldering layer (steel mesh) is: chemical etch, laser cutting, and electroform.

Chemical etch-data file PCB-film production-exposure-development-etching-steel cleaning-screening;

Laser cutting (laser cutting)--Film making PCB - take coordinates - data file - data processing - laser cutting - polishing - netting;
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