PCB Technical - What are the precautions for wave soldering during pcb assembly processing?

What are the precautions for wave soldering during PCB assembly processing?
We are a PCB assembly processing plant and SMT chip processing plant, so we may encounter some problems in the production process. For example: there are more post solders, so we need to choose wave soldering for processing at this time, so what should we pay attention to when we operate wave soldering? Now let's talk about the precautions for wave soldering during PCB assembly processing.

What are the precautions for wave soldering during PCB assembly processing?

The wave crest surface is covered by a layer of oxide scale, which remains almost static along the entire length of the solder wave. During the wave soldering process, the PCB touches the front surface of the tin wave, the oxide scale is broken, and the tin wave in front of the PCB is not The folds are pushed forward? This means that the entire oxide skin moves at the same speed as the PCB.

Generally, in order to avoid poor wave soldering, the following methods can be used to avoid:

Use components/PCBs with good solderability to improve the activity of the soldering, increase the preheating temperature of the PCB, increase the wettability of the pad, increase the temperature of the solder, remove harmful impurities, and reduce the cohesion of the solder? To facilitate the two soldering Separate the solder between the points.

Common preheating methods in wave soldering machines:

Air convection heating, infrared heater heating, hot air and radiation combined method heating; wave soldering process curve analysis: wetting time refers to the time when the solder joint is in contact with the solder, and the residence time refers to a certain one on the PCB The time for the solder joint from contacting the wave surface to leaving the wave surface. The preheating temperature refers to the temperature reached before the PCB and the wave surface contact, and the soldering temperature refers to the soldering temperature which is a very important soldering parameter. Usually 50°C ~ 60°C higher than the melting point of the solder (183°C). In most cases, the temperature of the soldering furnace is lower than the temperature of the soldering point of the PCB during actual operation. This is due to the heat absorption of the PCB. .
The above is the content related to the precautions for wave soldering operation in the shared PCBAssembly processing. Have everyone mastered it? If you have any technical questions about PCB assembly, you can keep in touch with us at any time, and we will discuss and make progress together!
iPCB is happy to be your business partner. Our business goal is to become the most professional prototypingma PCB nufacturer in the world. With more than ten years of experience in this field, we are committed to meeting the needs of customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requirements. As one of the most experienced PCB manufacturers and SMT assemblers in China, we are proud to be your best business partner and good friend in all aspects of your PCB needs. We strive to make your research and development work easy and worry-free.