PCB Technical - The basic operation process of reflow soldering

The basic operation process of reflow soldering
Reflow soldering is to solder the components to the PCB board, and reflow soldering is to mount the components on the surface. Reflow soldering relies on the effect of hot airflow on the solder joints. The colloidal flux physically reacts under a certain high temperature airflow to achieve SMD soldering; the reason why it is called "reflow soldering" is because the gas circulates in the soldering machine to generate high temperature to achieve soldering. Purpose.

When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate, and at the same time, the flux in the solder paste wets the pads, component ends and pins, and the solder paste softens, collapses, and covers the pads. Isolate the pads and component pins from oxygen.

When the PCB enters the heat preservation area, the PCB and components are fully preheated to prevent the PCB from suddenly entering the welding high temperature area and damaging the PCB and components.
When the PCB enters the soldering area, the temperature rises rapidly to make the solder paste reach a molten state, and the liquid solder wets, diffuses, flows, or reflows to the PCB pads, component ends and pins to form solder joints.
When the PCB enters the cooling zone, the solder joints are solidified; the reflow soldering is completed.
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