PCB Technical - Suggestions on the optimization of wave soldering process in PCBA manufacturing

Suggestions on the optimization of wave soldering process in PCBA manufacturing
As the volume of electronic products is becoming smaller and smaller, the precision of the entire assembly of PCBA is getting higher and higher. As a result, the volume of the entire electronic components can no longer be described as small, and they are directly tiny components. In addition, the wave soldering process, solder material, PCB circuit board quality, equipment and other factors affect the soldering quality. Therefore, there are many invisible defects in the wave soldering process, which are generally not easy to detect during appearance inspection. Often after being handed over to the customer, during use, due to factors such as power-on, vibration, and environmental temperature changes, the solder joints fail prematurely. In response to this situation, the editor of Jingbang Electronics will give you some suggestions.

Finally, some suggestions for wave soldering process:

1. Many defects of wave soldering clocks are related to PCB design, so DFM must be considered

2. Many defects are related to the quality of PCB and SMD processing components, in order to avoid the impact of fake and inferior components on quality. Qualified suppliers should be selected, with controlled logistics and storage conditions.

3. Many defects are caused by insufficient flux activity. A good flux can withstand high temperatures, prevent bridging, and improve the tin penetration of through holes.

4. Set the wave soldering temperature as low as possible to prevent components from overheating and material damage, especially to control the secondary tin melting in the mixed assembly process.

5. The low solder temperature can reduce solder oxidation, reduce tin slag, and reduce the erosion of molten solder on the solder tank and impeller. Limit the formation of FeSn2 crystals.

6. Excellent process control can reduce the defect level. The process parameters should be adjusted comprehensively, and the temperature curve must be controlled.

7. Pay attention to the maintenance of the solder in the tin furnace and strengthen the daily maintenance of the equipment.
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