PCB Technical - Detailed explanation of PCB circuit board via clogging solution

Detailed explanation of PCB circuit board via clogging solution
Via hole is also called via hole. In order to meet customer requirements, the via holes must be plugged in the PCB process. It has been found through practice that in the process of plugging, if the traditional aluminum sheet plugging process is changed, and the white mesh is used to complete the board surface solder mask and plugging, the PCB production can be stable and the quality is reliable.
The development of the electronics industry promotes the development of PCB at the same time, and also puts forward higher requirements on the production process of printed boards and surface mount technology. The Via hole plugging process came into being, and the following requirements should be met at the same time:
(1) It is sufficient if there is copper in the through hole, and the solder mask can be plugged or not plugged;
(2) There must be tin-lead in the through hole, with a certain thickness requirement (4 microns), and no solder mask ink should enter the hole, causing tin beads to be hidden in the hole;
(3) The through holes must have solder mask ink plug holes, opaque, and must not have tin rings, tin beads, and flatness requirements;

With the development of electronic products in the direction of "light, thin, short, and small", PCBs have also developed to high density and high difficulty. Therefore, a large number of smt and BGA PCBs have appeared, and customers require plugging when mounting components, mainly including Five functions:
(1) Prevent the tin from passing through the component surface through the through hole to cause a short circuit when the PCB is wave soldered; especially when the via is placed on the BGA pad, the plug hole must be made first, and then gold-plated, which is convenient for BGA soldering;
(2) Avoid flux residue in the vias;
(3) After the surface mounting and component assembly of the electronics factory are completed, the PCB must be vacuumed on the testing machine to form a negative pressure to complete;
(4) Prevent surface solder paste from flowing into the hole, causing false soldering and affecting placement;
(5) Prevent the tin beads from popping up during wave soldering, causing short circuits;
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