9 points of attention for PCB board copper
The so-called copper pour is to use the unused space on the PCB as a reference surface and then fill it with solid copper. These copper areas are also called copper filling. The significance of copper coating is to reduce the impedance of the ground wire and improve the anti-interference ability; reduce the voltage drop and improve the efficiency of the power supply; connecting with the ground wire can also reduce the loop area.
Those problems that need to be paid attention to in terms of copper coating:
1. If the PCB board has many grounds, such as SGND, AGND, GND, etc., according to the position of the PCB board, the main "ground" is used as a reference to independently pour copper, and the digital ground and analog ground are separated There is not much to say about copper coating. At the same time, before copper coating, first thicken the corresponding power connections: 5.0V, 3.3V, etc., in this way, multiple deformable structures with different shapes are formed. 2
2. For single-point connections to different grounds, the method is to connect through 0 ohm resistors or magnetic beads or inductance;
3. For the copper coating near the crystal oscillator, the crystal oscillator in the circuit is a high-frequency emission source. The method is to coat copper around the crystal oscillator, and then ground the shell of the crystal oscillator separately.
4. The island (dead zone) problem, if you think it is too big, it won't cost much to define a ground via and add it in.
5. At the beginning of the wiring, the ground wire should be treated equally, and the ground wire should be routed well when wiring, and you cannot rely on the covering.
After the copper is added via holes to eliminate the ground pins for the connection, this effect is very bad. -
6. It is best not to have sharp corners on the PCB board ("=180 degrees), because from the perspective of electromagnetics, this constitutes a transmitting antenna! For other things, it is only big or small. I recommend using the edge of the arc.
7. Do not apply copper in the open area of the middle layer of the multilayer board. Because it is difficult for you to make this copper "good grounding"
8. The metal inside the device, such as metal radiators, metal reinforcement strips, etc., must be "good grounding".
9. The heat-dissipating metal block of the three-terminal regulator must be well grounded. The ground isolation strip near the crystal oscillator must be well grounded. In short: if the grounding problem of the copper on the PCB board is dealt with, it is definitely "pros outweigh the disadvantages", it can reduce the return area of the signal line and reduce the electromagnetic interference of the signal to the outside.
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